Patent classifications
H03F2200/114
HIGH SENSITIVITY PHOTODETECTOR WITH HIGH-GAIN TRANSIMPEDANCE AMPLIFIER
One aspect of the present technology relates to a device. The device includes a sensor having an anode and a cathode. An operational amplifier (op-amp) having a single-ended output terminal, a non-inverting input, and an inverting input, is operatively coupled to one of the anode or the cathode of the sensor by the inverting input. A feedback resistor having a resistance of at least approximately one giga-ohm (1 G) is operatively coupled between the single-ended output terminal and the inverting input of the op-amp. A grounded field shunt is positioned adjacent to the feedback resistor. The op-amp, grounded field shunt, and feedback resistor are disposed within an electrical shield enclosure. The single-ended output terminal of the op-amp terminates outside of the electrical shield enclosure.
Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
An embodiment of a Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and a peaking amplifier die. The RF signal splitter divides an input RF signal into first and second input RF signals, and conveys the first and second input RF signals to first and second splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier die includes one or more second power transistors configured to amplify, along a peaking signal path, the second input RF signal to produce an amplified second RF signal. The carrier and peaking amplifier die are coupled to the substrate so that the RF signal paths through the carrier and peaking amplifier die extend in substantially different (e.g., orthogonal) directions.
POWER AMPLIFIER MODULE
A power amplifier module includes a first substrate and a second substrate, at least part of the second substrate being disposed in a region overlapping the first substrate. The second substrate includes a first amplifier circuit and a second amplifier circuit. The first substrate includes a first transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; a second transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; and multiple first conductors disposed in a row between the first transformer and the second transformer, each of the multiple first conductors extending from the wiring layer on a first main surface to the wiring layer on a second main surface of the substrate.
MODULE
A module includes a substrate having a main surface, a first component mounted on the main surface, and a first wire group constituted of three or more wires in parallel with each other that are bonded to the main surface so as to straddle the first component while extending in a first direction. When sections are defined along a second direction perpendicular to the first direction, the first wire group includes a first section in which a distance between wires adjacent to each other is a first length and a second section in which a distance between wires adjacent to each other is a second length longer than the first length.
BROADBAND HIGH POWER AMPLIFIER
The invention relates to a broadband high power amplifier that comprises a signal input adapted to receive an input signal, at least one amplifier stage adapted to amplify the received input signal, a signal output adapted to output the signal amplified by the at least one amplifier stage as an output signal, a monitoring unit adapted to monitor signal characteristics of the input signal and the output signal and a control unit adapted to operate the at least one amplifier stage at an optimal operating point depending on the current signal characteristics monitored by said monitoring unit.
CIRCUIT MODULE
A circuit module (100) includes an electronic component (30), a plurality of conductor posts (40), a mold layer (50) that seals a plurality of the electronic components (30) and the plurality of conductor posts (40), and a shield layer (60) on the mold layer (50). The electronic components (30) include a first electronic component (31) and second electronic components (32, 36). The plurality of conductor posts (40) includes a group of conductor posts (400) traversing between the first electronic component (31) and the second electronic components (32, 36). The shield layer (60) includes a slit (600) that, with respect to each conductor post (40) included in the group (400) of conductor posts, in a plan view, passes and extends between the conductor post (40) and the first electronic component (31), or between the conductor post (40) and the second electronic components (32, 36).
High-precision impedance measurement device
An impedance measurement device of the present disclosure includes: an electrochemical energy device; an amplifier connected to each connection terminal of the electrochemical energy device and configured to amplify a signal introduced into a wiring; and a main board configured to receive the signal from the amplifier and measure an impedance. Accordingly, the present invention has advantages in that high resistance to electromagnetic interference may be achieved by disposing a preamplifier close to a terminal of an electrochemical energy device to amplify only the signal without amplifying a noise introduced into a wiring.
RADIO FREQUENCY POWER AMPLIFIER MODULE
Disclosed is a radio frequency power amplifier module. The radio frequency power amplifier module according to an embodiment of the disclosed technology includes a module main body one or more amplifier semiconductors installed inside the module main body, and a coupler electrically connected to the amplifier semiconductor and protruding and extending to the outside of the module main body to transmit electromagnetic waves.
OPTIMIZING POWER EFFICIENCY OF A POWER AMPLIFIER CIRCUIT TO REDUCE POWER CONSUMPTION IN A REMOTE UNIT IN A WIRELESS DISTRIBUTION SYSTEM (WDS)
Embodiments of the disclosure relate to optimizing power efficiency of a power amplifier circuit to reduce power consumption in a remote unit in a wireless distribution system (WDS). A power amplifier circuit is provided in the remote unit to amplify a received input signal associated with a signal channel(s) to generate an output signal at an aggregated peak power. In this regard, a control circuit is configured to analyze at least one physical property related to the signal channel(s) to determine a maximum output power of the power amplifier circuit. Accordingly, the control circuit configures the power amplifier circuit according to the determined maximum output power. By configuring the maximum output power based on the signal channel(s) in the input signal, it may be possible to optimize the power efficiency of the power amplifier circuit, thus helping to reduce the power consumption of the remote unit.
Communications device with receiver chain of reduced size
A communications device includes a transmission chain coupled to an antenna a receiver chain coupled to the antenna. The receiver chain includes an amplifier device having an input coupled to the antenna. A controlled switching circuit is included in the amplifier device and is operable to selectively disconnect conduction terminals of an amplifying transistor from power supply terminals when the transmission chain is operating to pass a transmit signal to the antenna.