An embodiment of a module (e.g., an amplifier module) includes a substrate, a transmission line, and a ground plane height variation structure. The substrate is formed from a plurality of dielectric material layers, and has a mounting surface and a second surface opposite the mounting surface. A plurality of non-overlapping zones is defined at the mounting surface. The transmission line is coupled to the substrate and is located within a first zone of the plurality of non-overlapping zones. The ground plane height variation structure extends from the second surface into the substrate within the first zone. The ground plane height variation structure underlies the transmission line, a portion of the substrate is present between the upper boundary and the transmission line, and the ground plane height variation structure includes a conductive path between an upper boundary of the ground plane height variation structure and the second surface.

An amplifier may include a transistor and input and output matching networks. One or more harmonic trap circuits may be electrically connected to a node located between the input matching network and a gate terminal of the transistor or to a node located between the output matching network and a drain terminal of the transistor. Each harmonic trap may provide a low resistance path to ground for signal energy above a fundamental operating frequency of the amplifier, such as harmonic frequencies thereof. The output matching network may act as an impedance inverter that provides a 90 degree insertion phase between the input of the output matching network and the load. A variable length drain feeder may connect a voltage source to an output of the output matching network.

An amplifier package may include a transistor, an output impedance matching circuit and one or more radial stub harmonic traps coupled to a control terminal of the transistor or to an output terminal of the transistor. The output impedance matching circuit and the radial stub harmonic traps may be formed on a single substrate or separate substrates, which may be formed from gallium nitride. Each radial stub harmonic trap may provide a low resistance path to ground for signal energy above a fundamental operating frequency of the amplifier, such as harmonic frequencies thereof.

An apparatus includes a first directional coupler, a second directional coupler, a first detector, and a second detector. A through port of the first directional coupler is coupled to a through port of the second directional coupler. An isolated port of the first directional coupler is coupled to an isolated port of the second directional coupler. A coupled port of the first directional coupler is coupled to the first detector. A coupled port of the second directional coupler is coupled to the second detector. A detected power signal is generated by combining an output of the first detector and an output of the second detector.

Spatial power-combining devices and antenna assemblies for spatial power-combining devices are disclosed. The disclosure relates to spatial power-combining devices with segmented waveguides and antennas. The spatial power-combining devices may be designed for high efficiency, high or low frequency ranges, ultra-wide bandwidth operation, and high output power. A spatial power-combining device may include a plurality of amplifiers, an output center waveguide including an output inner housing and an output outer housing, and an output coaxial waveguide. The output center waveguide may form a plurality of output center waveguide segments that are discontinuous with each other. Each output center waveguide segment may include a different portion of the output inner housing and the output outer housing. An antenna for a spatial power-combining device may include a plurality of antenna segments, each of which includes a different portion of a signal conductor and a ground conductor of the antenna.

An amplifier includes amplification stages connected in parallel between an input point and an output point and a feedback circuit, wherein the amplification stages each include a transistor configured to amplify a signal supplied from the input point, a harmonic processing unit configured to process harmonics present in an amplified signal output from an output node of the transistor, a connection point between the output node and the harmonic processing unit, and a transmission line connecting the connection point and the output point, wherein the feedback circuit feeds back a signal at the output point or a midway point of the transmission line of a given one of the amplification stages to a first end of a resistor connected to the connection point of the given one of the amplification stages, a second end of the resistor being connected to the connection point of another one of the amplification stages.

A digital power amplifier comprising two or more individually activatable amplifiers. The outputs of the amplifiers are connected causing an activated amplifier of the two or more amplifiers to load modulate another activated amplifier of the two or more amplifiers.

An embodiment of an amplifier includes a first amplifier with a first output terminal, a second amplifier with a second output terminal, and a plurality of microstrip transmission lines electrically connected to the amplifiers. The transmission lines include an impedance inverter line electrically connected between the first and second output terminals, and an output line electrically connected between the second output terminal and an output of the amplifier, where the output line forms a portion of an output impedance transformer. The amplifier also includes a directional coupler formed from a main line and a coupled line positioned in proximity to the main line, where the main line is formed from a portion of one of the transmission lines. The amplifier may also include a module substrate with a plurality of metal layers, where the main line and the coupled line are formed from different portions of the metal layers.

An embodiment of a module (e.g., an amplifier module) includes a substrate, a transmission line, and a ground plane height variation structure. The substrate is formed from a plurality of dielectric material layers, and has a mounting surface and a second surface opposite the mounting surface. A plurality of non-overlapping zones is defined at the mounting surface. The transmission line is coupled to the substrate and is located within a first zone of the plurality of non-overlapping zones. The ground plane height variation structure extends from the second surface into the substrate within the first zone. The ground plane height variation structure underlies the transmission line, a portion of the substrate is present between the upper boundary and the transmission line, and the ground plane height variation structure includes a conductive path between an upper boundary of the ground plane height variation structure and the second surface.

In an example aspect, an apparatus includes a balanced power amplifier, which performs amplification in the presence of a variable antenna impedance. The balanced power amplifier includes a quadrature output power combiner coupled to a first power amplifying path and a second power amplifying path, detection circuitry, and control circuitry. The detection circuitry includes at least one power detector coupled to an isolated port of the quadrature output power combiner and a resistor coupled between the isolated port and a ground. The at least one power detector is configured to measure power at the isolated port, which is based on a resistance of the resistor. The control circuitry is configured to adjust operating conditions of a first power amplifier of the first power amplifying path and the second power amplifier of the second power amplifying path based on the power that is measured at the isolated port.