An isolation circuit and a method for providing isolation between two dies are provided. The isolation circuit includes: an isolation module, configured to generate an isolation signal based on an input signal from a first die and to provide isolation between the first die and a second die, where the isolation signal is smaller than the input signal in amplitude, and the first die is coupled with the second die; a latch module, configured to latch the isolation signal at a certain level and output a latched signal; an amplifier module, configured to amplify the latched signal. In the isolation circuit, a modulation module and a demodulation module can be saved.

A power efficient (PE) amplifier includes a cascode amplifier, a transistor amplifier, and a voltage supply. The transistor amplifier includes at least one differential pair of transistors and a plurality of transformers having a primary winding and a tapped secondary winding. The secondary winding is connected across emitters or sources of each transistor pair. The tap of each secondary has a current source. The primary windings of the plurality of transformers are connected in series. The transistor bases or gates are alternating current (AC) grounded. The collector or drain terminal pairs are connected in parallel. The voltage supply is low voltage and supplies a current to the cascode amplifier. The PE amplifier further includes a plurality of current sources which provide a total current to the transistor amplifier. The PE amplifier has, among other things, improved power gain, improved reverse isolation, improved power dissipation, and improved peak differential swing.

An isolation circuit and a method for providing isolation between two dies are provided. The isolation circuit includes: an isolation module, configured to generate an isolation signal based on an input signal from a first die and to provide isolation between the first die and a second die, where the isolation signal is smaller than the input signal in amplitude, and the first die is coupled with the second die; a latch module, configured to latch the isolation signal at a certain level and output a latched signal; an amplifier module, configured to amplify the latched signal. In the isolation circuit, a modulation module and a demodulation module can be saved.

An isolation amplifier includes an input circuit at high voltage potential with an input for a measurement signal to be transmitted, an input circuit configuration providing a coupling section signal representing the measurement signal, and a high-voltage-side control unit for driving the input circuit, a galvanically isolating coupling section for the potential-free transmission of the coupling section signal to an output circuit at low-voltage potential with an output circuit configuration for generating an output signal from the transmitted coupling section signal, an output for the output signal and at least one low-voltage-side control unit for generating control signals, input elements for inputting control commands and/or parameters into the high-voltage-side control unit, a low-voltage-side arrangement of all the input elements provided for the parameterization of the high-voltage-side control unit, exclusively in a low-voltage circuit, and a galvanically isolating control channel for transmitting the parameters for driving the input circuit.

A power amplifier module includes a first substrate and a second substrate, at least part of the second substrate being disposed in a region overlapping the first substrate. The second substrate includes a first amplifier circuit and a second amplifier circuit. The first substrate includes a first transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; a second transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; and multiple first conductors disposed in a row between the first transformer and the second transformer, each of the multiple first conductors extending from the wiring layer on a first main surface to the wiring layer on a second main surface of the substrate.

One example includes a device that is comprised of a pre-power amplifier, a power amplifier, a signal path, and a dynamic bias circuit. The pre-power amplifier amplifies an input signal and outputs a first amplified signal. The power amplifier receives the first amplified signal and amplifies the first amplified signal based on a dynamic bias signal to produce a second amplified signal at an output thereof. The signal path is coupled between an output of the pre-power amplifier and an input of the power amplifier. The dynamic bias circuit monitors the first amplified signal, generates the dynamic bias signal, and outputs the dynamic bias into the signal path.

A Galvanically Isolated Amplifier (GIA) includes an isolation barrier to galvanically isolate high voltage circuitry from low voltage circuitry. The high voltage circuitry has at least two voltage supply rails, with the voltage supply rail closest to ground potential at a first potential relative to the ground potential. The low voltage circuitry has at least two voltage supply rails, with the voltage supply rail closest to the ground potential at a second potential, the second potential being smaller than the first potential. A Radio Frequency (RF) carrier is digitally Phase Shift Keying (PSK) modulated for transmission across the isolation barrier. The unmodulated RF carrier could also be transmitted across the isolation barrier. PSK modulation could be applied to the RF carrier based on a test waveform to generate a PSK-modulated test signal for transmission while a voltage transient is applied between the high voltage circuitry and the low voltage circuitry.

One example includes a device that is comprised of a pre-power amplifier, a power amplifier, a signal path, and a dynamic bias circuit. The pre-power amplifier amplifies an input signal and outputs a first amplified signal. The power amplifier receives the first amplified signal and amplifies the first amplified signal based on a dynamic bias signal to produce a second amplified signal at an output thereof. The signal path is coupled between an output of the pre-power amplifier and an input of the power amplifier. The dynamic bias circuit monitors the first amplified signal, generates the dynamic bias signal, and outputs the dynamic bias into the signal path.

An isolation amplifier includes an input circuit at high voltage potential with an input for a measurement signal to be transmitted, an input circuit configuration providing a coupling section signal representing the measurement signal, and a high-voltage-side control unit for driving the input circuit, a galvanically isolating coupling section for the potential-free transmission of the coupling section signal to an output circuit at low-voltage potential with an output circuit configuration for generating an output signal from the transmitted coupling section signal, an output for the output signal and at least one low-voltage-side control unit for generating control signals, input elements for inputting control commands and/or parameters into the high-voltage-side control unit, a low-voltage-side arrangement of all the input elements provided for the parameterization of the high-voltage-side control unit, exclusively in a low-voltage circuit, and a galvanically isolating control channel for transmitting the parameters for driving the input circuit.

A digital isolator device which includes a first input buffer configured to receive a first differential signal from a transmitter and to provide a second differential signal, the first differential signal being characterized by a first magnitude, the second differential signal being characterized by a second magnitude, the first magnitude being greater than the second magnitude. The device also includes a second input buffer configured to receive a third differential signal from the transmitter and to provide a fourth differential signal, the second input buffer being coupled to the second ground terminal. The device also includes a common-mode circuit coupled to the second differential signal and the fourth differential signal, the common-mode circuit being configured to reduce a common-mode transient voltage, the common-mode transient voltage being associated with a voltage differential between the first ground terminal and the second ground terminal.