Provided is a high-gain amplifier based on double-gain boosting including a first gain amplification unit including a first amplifier, a second amplifier, and a an interstage matching network connected between the first amplifier and the second amplifier and performing primary amplification; and a second gain amplification unit connected in parallel with the first gain amplification unit and performing secondary boosting.

Circuits and methods for a multi-gain mode amplifier, particularly an LNA, that achieves wideband output impedance matching and high gain while maintaining low power and a low NF in a highest gain mode, and which can switch to one or more lower gain modes that achieve higher linearity with lower power. In a highest gain mode, an inductor is selectively inserted between the amplified-signal terminal of an amplification core and an output LC output matching network. The inductor, when inserted, provides wideband output impedance matching, functioning as a series peaking inductor; accordingly, the inserted inductor delays current flow to the output capacitor and lowers the rise time of signal changes across the output capacitor. In addition, higher gain can be achieved compared to a conventional LC output impedance matching topology due to a higher impedance at the amplified-signal terminal of the amplification core.

An apparatus for detecting difference in operating characteristics of a main circuit by using a replica circuit is presented. In one exemplary case, a sensed difference in operating characteristics of the two circuits is used to drive a tuning control loop to minimize the sensed difference. In another exemplary case, several replica circuits of the main circuit are used, where each is isolated from one or more operating variables that affect the operating characteristic of the main circuit. Each replica circuit can be used for sensing a different operating characteristic, or, two replica circuits can be combined to sense a same operating characteristic.

A multiple-path amplifier (e.g., a Doherty amplifier) includes first and second transistors (e.g., main and peaking transistors) with first and second output terminals, respectively, all of which is integrally-formed with a semiconductor die. A signal path through the second transistor extends in a direction from a control terminal of the second transistor to the second output terminal, where the second output terminal corresponds to or is closely electrically coupled to a combining node. The amplifier also includes an integrated phase delay circuit that is configured to apply an overall phase delay (e.g., 90 degrees) to a signal carried between the first and second output terminals. The integrated phase delay circuit includes delay circuit wirebonds coupled between the first and second output terminals, and the delay circuit wirebonds extend in a third direction that is angularly offset from (e.g., perpendicular to) the second direction.

An amplifier includes a package that includes a carrier amplifier having a carrier amplifier input and output, a peaking amplifier having a peaking amplifier input and output, and corresponding input and output leads. The package includes a first integrated passive device including a first capacitor structure. The first integrated passive device includes a first contact pad coupled to the peaking amplifier output and a second contact pad coupled to the peaking output lead. The package includes a second integrated passive device including a second capacitor structure. The second integrated passive device includes a third contact pad coupled to the carrier amplifier output and a fourth contact pad coupled to the carrier output lead. The amplifier includes input circuitry a combining node configured to combine a carrier output signal and a peaking output signal.

A dual-band MMIC power amplifier and method of operation to amplify frequencies in different RF bands while only requiring input drive signals at frequencies f.sub.1 and f.sub.2 in a narrow RF input band. This allows for the use of a conventional narrowband RF IC to drive the MMIC and does not require additional circuitry (e.g., a LO) on the MMIC power amplifier. The matching network of the last amplification stage is modified to pass f.sub.1 (or a harmonic thereof), reflect f.sub.2, pass a P.sup.th harmonic of f.sub.2 where P is 2 or 3 and to reflect any unused 1.sup.st, 2.sup.nd or 3.sup.rd order harmonics of f.sub.1 or f.sub.2 back into the MMIC. In response to an input signal at f.sub.1, the MMIC power amplifier amplifies and outputs a signal at f.sub.1 (or a harmonic thereof). In response to an input signal at f.sub.2 at sufficient RF power, the last amplification stage operates in compression such that the MMIC power amplifier generates the harmonics, selects the P.sup.th harmonic and outputs an amplified RF signal at P*f.sub.2.

A power amplifier circuit is provided that includes a transmission circuit, a control circuit, a first terminal, and a second terminal. The transmission circuit includes an amplifier element that amplifies power of a radio frequency signal. The control circuit controls the transmission circuit. The first terminal receives a serial data signal that is based on a serial data standard. The second terminal receives a digital signal different from the serial data signal. The control circuit then controls the transmission circuit in response to the digital signal received from the second terminal.

A radio frequency (RF) amplifier and a bias circuit are provided. The RF amplifier includes an amplifier, a first inductive-capacitive resonance circuit, and a first bias circuit. The amplifier includes an input terminal configured to receive an incoming RF signal through a first RF path. The first inductive-capacitive resonance circuit includes a first terminal coupled to a first reference voltage. A second terminal of the first inductive-capacitive resonance circuit is coupled to the first RF path. In response to the first reference voltage being at a first reference level, the RF amplifier is enabled; in response to the first reference voltage being at a second reference level, the RF amplifier is disabled. The first bias circuit includes a first terminal configured to be coupled to the first reference voltage and a second terminal coupled to the input terminal of the amplifier to provide a first direct current (DC) component.

The present disclosure is to improve the power added efficiency of a power amplifier at high output power. The power amplifier includes: a first capacitor with a radio frequency signal input to one end thereof; a first transistor whose base is connected to the other end of the first capacitor to amplify the radio frequency signal; a bias circuit for supplying bias to the base of the first transistor; and a second capacitor with one end connected to the base of the first transistor and the other end connected to the emitter of the first transistor.

Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.