A system and method which includes receiving an input signal having an envelope and generating an envelope detection signal corresponding to the envelope. A bias current provided to an amplifier circuit is adjusted based upon the envelope detection signal, the amplifier circuit including an amplifier and a transformer. The transformer is configured to establish a magnetically coupled feedback loop from an output of the amplifier to an input of the amplifier. An output signal is provided, by the amplifier circuit, in response to the input signal.

A power amplifier comprising: a first amplifier; a second amplifier, wherein the first and second amplifiers are arranged in parallel; an analogue pre-distortion network; a first coupler; and a second coupler, wherein the first coupler is configured to receive an input signal, direct said input signal to the first amplifier, and direct a first pre-distortion signal to the analogue pre-distortion network, wherein the first pre-distortion signal comprises a first distortion component generated at the input of the first amplifier, and the analogue pre-distortion network is configured to receive the first pre-distortion signal and manipulate its amplitude and/or phase to obtain a manipulated first pre-distortion signal, and the second coupler is configured to direct the manipulated first pre-distortion signal to the second amplifier.

A power amplifier comprises a first transistor, a first transformer, a first variable resistor, a first bias circuit and coupling circuitry configured to couple the first transformer, a first end of the first variable resistor, and a collector of the first transistor at a first node, the first transformer and a second end of the first variable resistor at a second node, and the bias circuit and a base of the first transistor at a third node.

An uplink multiple input-multiple output (MIMO) transmitter apparatus includes a transmitter chain that includes a sigma-delta circuit that creates a summed (sigma) signal and a difference (delta) signal from two original signals to be transmitted. These new sigma and delta signals are amplified by power amplifiers to a desired output level before having two signals reconstructed from the amplified sigma and amplified delta signals by a second circuit. These reconstructed signals match the two original signals in content but are at a desired amplified level relative to the two original signals. The reconstructed signals are then transmitted through respective antennas as uplink signals. By employing this uplink MIMO transmitter apparatus, it is possible to use smaller power amplifiers, which may reduce footprint, power consumption, and costs of the uplink MIMO transmitter apparatus.

According to one aspect, an integrated circuit having a radio frequency amplifier includes at least two amplifier stages and an impedance matching device between two amplifier stages of the radio frequency amplifier. The matching device includes two lines which are coupled by electromagnetic induction. The first line is connected to an output of the first amplifier stage and the second line is connected to an input of the second amplifier stage.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.

A transceiver interface for a phased array element includes a first magnetic circuit having a primary coil and a secondary coil, a second magnetic circuit having a primary coil, a secondary coil and a tertiary coil, a main amplifier path and an auxiliary amplifier path, the main amplifier path coupled to the primary coil of the second magnetic circuit and configured to receive a quadrature signal, the main amplifier path configured to provide a quadrature output signal, the auxiliary amplifier path coupled to the primary coil of the first magnetic circuit and configured to receive an in-phase signal, the auxiliary amplifier path configured to provide an in-phase output signal, a selectable output circuit configured to selectively combine the in-phase output signal and the quadrature output signal, and a low noise amplifier (LNA) coupled to the tertiary coil of the second magnetic circuit.

In a power amplifying module in which a plurality of differential amplifying circuits is mounted on a substrate, each of the differential amplifying circuits includes a chip device that includes at least two amplifiers, each of the at least two amplifiers amplifying a differential signal, a balun that includes a primary side winding wire and a secondary side winding wire, both ends of the primary side winding wire being connected to an output of the chip device, and a capacitor provided between a power feed point of the primary side winding wire and a reference potential. In at least one of the plurality of the differential amplifying circuits, the distance from one end of the primary side winding wire to the power feed point is different from the distance from the other end of the primary side winding wire to the power feed point.

In many examples, a device comprises a transmitter. The transmitter comprises a power amplifier, a first transformer coil coupled to the power amplifier, and a second transformer coil adapted to be electromagnetically coupled to the first transformer coil. The transmitter also comprises a first bond wire coupled to a first end of the second transformer coil and adapted to be coupled to a first end of an antenna, a capacitor coupled to a second end of the second transformer coil, a switch coupled to the capacitor and configured to engage and disengage the capacitor from the transmitter, and a second bond wire coupled to the switch and adapted to be coupled to a second end of the antenna.

An RF power amplifier is described including a first amplifier and a second amplifier arranged in parallel between an RF power amplifier input and an RF power amplifier output. A phase adjuster adjusts the phase of a signal on at least one of the first amplifier signal path and the second amplifier signal path. A first impedance inverter has a first impedance inverter input coupled to an output of the second amplifier and a first impedance inverter output coupled to the RF power amplifier output. The RF power amplifier is configured to enable at least one of the first amplifier and the second amplifier dependent on an operation mode and the first impedance inverter is configured to modulate the load impedance of the second amplifier in response to the operation mode changing.