A noise filter and an electronic device including the same are disclosed. The noise filter is configured to suppress noise generated in a power line or a ground line of a power circuit unit provided in an electronic device. The electronic device including: at least one coil connected to the power line and the ground line; and a core around which the coil is wound, a common core portion configured to suppress common mode noise generated at the ground line and a normal core portion configured to suppress normal mode noise generated at the power line are formed as a single body. Thus, the common mode noise filter and the normal mode noise filter are integrated with each other to thereby improve productivity and reduce production costs.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

A filter component includes a housing body. A first and at least one second busbar each have a first end section, and a second end section, between which in each case a center section is arranged. The end sections of the busbars each have connections for connecting electrical conductors to the filter component. The first and second end section and the center section of the first busbar are arranged in a first plane and the first and second end section and the center section of the at least one second busbar are arranged in a second plane, which is different from the first plane.

An electronic apparatus includes an electromagnetic radiation source structure and an electromagnetic radiation suppression structure. The electromagnetic radiation source structure is formed in at least one first semiconductor die. The electromagnetic radiation suppression structure is formed in a second semiconductor die, and is used for generating an inverse electromagnetic radiation against the electromagnetic radiation emission of the electromagnetic radiation source structure by sensing the electromagnetic radiation emission of the electromagnetic radiation source structure, to suppress the electromagnetic radiation emission of the electromagnetic radiation source structure from passing through the electromagnetic radiation suppression structure. Another electronic apparatus includes an electromagnetic radiation source structure and an electromagnetic radiation suppression structure. The electromagnetic radiation suppression structure is formed in a printed circuit board. The electromagnetic radiation source structure is formed in a semiconductor die. Associated electromagnetic radiation suppression methods are also disclosed.

There has been a problem of generating anti-resonance between a three-terminal capacitor and a capacitor when the three-terminal capacitor and the capacitor are mounted. In order to solve the problem, this electronic circuit includes: a capacitor and a three-terminal capacitor, which are connected to a power supply terminal of a circuit component, and a power supply, and which are connected in parallel to each other between the power supply and ground; and a resistor that is connected in series between the ground and a ground terminal of the three-terminal capacitor and/or the capacitor.

A flexible resistive tip cable assembly includes a probe Radio Frequency (RF) connector structured to receive a RF differential signal and a testing connection assembly. A coaxial cable is structured to conduct the RF differential signal between the probe RF connector and the testing connection assembly. The coaxial cable includes a cable for conducting the differential signal, and a plurality of magnetic elements positioned along a length of the cable and structured to isolate the differential signal from common mode interference. The magnetic elements are separated from adjacent magnetic elements by a gap with elastomeric elements is positioned in each gap to provide cable flexibility. The assembly may also include an Electrically Erasable Programmable Read Only Memory (EEPROM) loaded with an attenuation associated with the flexible resistive tip cable assembly for use in signal testing by a device coupled to the testing connection assembly.

Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

A noise filter includes a first capacitor and a second capacitor which are two line-to-line capacitors. Currents flowing through the first capacitor and the second capacitor are in directions opposite to each other, and meanwhile, currents flowing through a first connection wire and a second connection wire are in the same direction and parallel to each other. Accordingly, magnetic coupling is caused between the connection wires and the line-to-line capacitors. Thus, the residual inductance of a line-to-line capacitor itself is reduced, whereby an attenuation characteristic for normal mode noise is further improved.