An enclosure for electronics includes a base, a base cover, a gasket, and an enclosure cover. The base receives one or more electronic elements. The base cover is mounted over the first base to secure the electronic elements within the base and form a unit having a groove in at least a part of the periphery of the unit. The gasket resides within the groove of the first unit. The enclosure cover is mounted over the first unit and the gasket and applies a compressive force to the gasket such that the gasket (i) forms a seal for the enclosure and (ii) applies force that secures at least a part of the periphery of the first base cover to at least a part of the periphery of the first base. In a single-unit assembly, the enclosure cover is an assembly cover that attaches to the unit. In a dual-unit assembly, each unit functions as the enclosure cover for the other unit in a clam-shell configuration.

A radio frequency module includes a switch circuit that includes selection terminals, a filter that allows the signal in the first frequency band to pass therethrough, a filter that allows the signal in the second frequency band to pass therethrough, a phase adjustment circuit that is connected to the selection terminal and the filter, and a phase adjustment circuit that is connected to the selection terminal and the filter. The filter includes an acoustic wave resonator that is formed on a substrate that has piezoelectricity. The filter includes an acoustic wave resonator that is formed on a substrate that has piezoelectricity. At least one of circuit elements that are included in the phase adjustment circuit is formed on the substrate. At least one of circuit elements that are included in the phase adjustment circuit is formed on the substrate.

A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main, an insulating holder, inductors provided in the holder, receiving terminal fittings provided in the holder, insertion-side terminal fittings capable of being fitted to the receiving terminal fittings, a U-phase capacitor provided between the U-phase wire and the U-phase insertion-side terminal fitting, a V-phase capacitor provided between the V-phase wire and the V-phase insertion-side terminal fitting, and a W-phase capacitor provided between the W-phase wire and the W-phase insertion-side terminal fitting.

A conductive path includes a plurality of covered electrical conductors that are obtained by enveloping a plurality of conductive path main bodies with insulating layers; a plurality of conductors that are individually fixed to outer circumferential surfaces of the insulating layers, capacitors being formed individually between the conductors and the conductive path main bodies; a body having a holder; a plurality of arc-shaped positioning recesses that are formed in the holder and are configured to respectively keep the plurality of covered electrical conductors positioned; a plurality of inductors that are respectively connected to the plurality of conductors and are fixed to the body; and a connector that is formed on the inductors, is exposed in an arc shape on an inner circumferential surface of the positioning recesses, and comes into contact with the conductors in a state in which the covered electrical conductors are held in the positioning recesses.

According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port. According to some embodiments, the first LC resonator unit serves as an impedance matching circuit for a first signal having a first resonant frequency and serves as an open circuit for a second signal having a second resonant frequency that is different from the first resonant frequency; the second LC resonator unit serves as an impedance matching circuit for the second signal having the second resonant frequency and serves as an open circuit for the first signal having the first resonant frequency. The first filter unit passes signals with the first resonant frequency; and the second filter unit passes signals with the second resonant frequency.

The invention which relates to an EMC filter (1) addresses the problem of specifying an EMC filter (1) that is simple of structure, cost-effective and temperature resistant. This problem is resolved thereby that the core of the choke (4, 5) is comprised of one or two core parts (10), that at least one first planar or convex heat transfer area (23) is located on an outside of the core and that the core with this first planar or convex heat transfer area (23) is disposed on a housing (12) of the refrigerant compressor, wherein the housing (12) in the region of the first planar or convex heat transfer area (23) is implemented planar or concave.

An electronic component includes an antenna electrode functioning as a first electrode plate, a circuit board functioning as a second electrode plate, and a short-circuit section that electrically connects the antenna electrode and the circuit board. The circuit board includes a surface functioning as a first surface opposed to the antenna electrode, a grounding section, a circuit component functioning as a conductive structure disposed on the surface, and a wiring pattern that connects the circuit component and the grounding section.

An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 m for electromagnetic signals having frequencies in a kilohertz range.

An integrated circuit includes a capacitor (e.g., a folded metal-oxide-metal (MOM) capacitor) formed in the lower BEOL interconnect levels, without degrading an inductor's Q-factor. The integrated circuit includes the capacitor in one or more back-end-of-line (BEOL) interconnect levels. The capacitor includes multiple folded capacitor fingers having multiple sides and a pair of manifolds on a same side of the folded capacitor fingers. Each of the pair of manifolds is coupled to one or more of the folded capacitor fingers. The integrated circuit also includes an inductive trace having one or more turns in one or more different BEOL interconnect levels. The inductive trace overlaps one or more portions of the capacitor.

The present invention provides a noise suppression device and equivalent circuit thereof. The noise suppression device comprises a metal plate and at least one first resonance unit. The first resonance unit comprises a plurality of first resonators. Each of the first resonators comprises a first metal segment and at least one first conductive connection segment, the first metal segment is connected to the first conductive connection segment. When the first resonance unit is configured on the metal plate, each of the first metal segments is electrically connected to the metal plate by the corresponding first conductive connection segment. When the resonance of the first resonator occurs, a noise transmitted on the metal plate can be conducted to the first resonator and suppressed by the first resonator.