An integrated transformer and an electronic device are disclosed. The integrated transformer includes at least one first base plate and at least one second base plate. Each of the first and second base plate defines multiple annular accommodating grooves. The annular accommodating grooves divide each of the first and second base plate into multiple central parts and a peripheral part Each central part defines multiple inner via holes there through. The peripheral part defines multiple outer via holes there through. The integrated transformer further includes multiple magnetic cores disposed in the respective annular accommodating groove and transmission wires disposed on both sides of the first and second base plates. Transformers and the filters are arranged on two base plates respectively, and the thickness of the transmission wire layers of the filters is less than that of the transformers. Thus, the structure of the electromagnetic device may be more compact.

Disclosed herein is a common mode filter that includes: a winding core part including first and second winding areas and a third winding area positioned between the first and second winding areas; and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block wound in the first winding area and a second winding block wound in the second winding area. The first and second wires cross each other in the third winding area. Each of the first and second winding blocks has first and second winding layers. The difference in a number of turns between the first winding layer and the second winding layer is larger in the first winding block than in the second winding block.

A radio frequency filter is provided and includes a dielectric layer and a first inductor. The first inductor includes an input, a first coil disposed on a first side of the dielectric layer and connected to the input, and a second coil disposed on a second side of the dielectric layer opposite the first side. The first and second coils are planar, such that windings of the first coil are in a first layer and windings of the second coil are in a second layer. The first coil overlaps and is connected in series with the second coil. The first coil, the dielectric layer and the second coil collectively provide a capacitance of the radio frequency filter. The first inductor further includes a first via extending through the dielectric layer and connected to the first coil and the second coil and a first output connected to the second coil.

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

Disclosed herein is a common mode filter that includes a winding core part and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block on one endmost side in an axial direction of the winding core part, a second winding block on other endmost side in the axial direction of the winding core part, and a third winding block positioned between the first and second winding blocks. The second winding block is a winding block at an odd-numbered position counted from the first winding block. The first and second wires cross each other in an area between the first and third winding blocks and in an area between the second and third winding blocks.

A complex electronic component includes: an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes: first and second discharging electrodes having a gap disposed therebetween; a blocking layer disposed between the first and second discharging electrodes; and a discharging layer which is disposed to cover an upper portion of the blocking layer and is in contact with top surfaces of the first and second discharging electrodes.

Radio frequency devices and methods are provided where a network like a filter network or impedance matching network comprises a series connection of at least two inductors.

Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.

An electronic component includes a multilayer body, a primary coil including an n-number primary coil conductor layers and one series coil conductor layer, a secondary coil including an n-number secondary coil conductor layers, and a tertiary coil including an n-number tertiary coil conductor layers. The arrangement includes one primary coil conductor layer, one secondary coil conductor layer, and one tertiary coil conductor layer in this order from a first side to a second side of a laminating direction. The series coil conductor layer is electrically connected in series to the n-number primary coil conductor layers and is provided at the second side of the laminating direction with respect to the tertiary coil conductor layer closest to the second side of the laminating direction.