In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

A half-bride combiner can be implemented as a coupling circuit having a common node and configured to couple the common node to one of first and second groups of filters through a first path and to couple the common node to the other group through a second path. The coupling circuit can be further configured such that the impedance provided by each filter of the one of the first and second groups for a signal in each band of the other group results in the signal being sufficiently excluded from the first path.

A half-bride combiner can be implemented as a coupling circuit having a common node and configured to couple the common node to one of first and second groups of filters through a first path and to couple the common node to the other group through a second path. The coupling circuit can be further configured such that the impedance provided by each filter of the one of the first and second groups for a signal in each band of the other group results in the signal being sufficiently excluded from the first path.

A radio frequency circuit includes a switch that includes a terminal connected to an antenna connection terminal and terminals, a duplexer that is connected to the terminal and has a pass band including a communication band A, a duplexer that is connected to the terminal and has a pass band including a communication band B which is available for simultaneous communication with the communication band A, a switch that includes a terminal connected to the terminal and terminals, a duplexer that is connected to the terminal and has a pass band including a communication band C, and a transmit/receive filter that is connected to the terminal and has a pass band including a communication band D.

A wireless transceiver circuit with an impedance matching network within an integrated circuit is disclosed. In some embodiments, the impedance matching network utilizes an inductor, having two portions, disposed on two different metal layers of the integrated circuit. The first end of the first portion of the inductor is in communication with an antenna. The second end of the second portion is in communication with a low noise amplifier for receiving signals and a power amplifier for transmitting RF signals. The second end of the first portion is connected to the first end of the second portion using a via. In another embodiment, the two portions are disposed on the same metal layer, wherein one portion is disposed within the other with a gap separating the two portions. These configurations require less space than using two separate inductors and also have a low coupling coefficient.

A filter includes an input terminal, an output terminal, a first ground terminal, a second ground terminal, a first inductor having a first end coupled to a first node in a path between the input terminal and the output terminal and a second end coupled to a second node, a second inductor having a first end coupled to the second node and a second end coupled to the first ground terminal, and a third inductor having a first end coupled to the second node and a second end coupled to the second ground terminal.

A filter includes an input terminal, an output terminal, a first ground terminal, a second ground terminal, a first inductor having a first end coupled to a first node in a path between the input terminal and the output terminal and a second end coupled to a second node, a second inductor having a first end coupled to the second node and a second end coupled to the first ground terminal, and a third inductor having a first end coupled to the second node and a second end coupled to the second ground terminal.

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.

An architecture can include a first group of filters each configured to support a band such that a first frequency range covers the respective bands, and a second group of one or more filters each configured to support a band such that a second frequency range covers the respective one or more bands. Each filter of the first group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the second group, and each filter of the second group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the first group. The filters of the first and second groups can be implemented as one or more multiplexers. The architecture can further include a coupling circuit having a common node and configured to couple the common node to the one or more multiplexers through a first path and a second path. The coupling circuit can be further configured such that the impedance provided by each filter of the first group for the signal in each band of the second group results in the signal being sufficiently excluded from the first path, and such that the impedance provided by each filter of the second group for the signal in each band of the first group results in the signal being sufficiently excluded from the second path.