H03H11/02

RECONFIGURABLE INTELLIGENT SURFACE REALIZED WITH INTEGRATED CHIP TILING

Disclosed is an electromagnetic-circuit co-design approach for massively reconfigurable, multifunctional, and high-speed programmable metasurfaces with integrated chip tiling. The ability to manipulate the incident electromagnetic fields in a dynamically programmable manner and at high speeds using integrated chip tiling approach is also disclosed. The scalable architecture uses electromagnetic-circuit co-design of metasurfaces where each individual subwavelength meta-element is uniquely addressable and programmable. The disclosed device comprises a large array of such meta-elements. The design relies on integrated high frequency switches designed in conjugation with meta-element for massive reconfigurability of incident amplitude and phase. The disclosed chip is multi-functional and can perform beamforming, high speed spatial light modulation, dynamic holographic projections, and wavefront manipulation.

Resonant LC Power Network for Superconducting Digital Circuits
20230208400 · 2023-06-29 ·

A superconducting circuit comprises a resonator and a Josephson junction. The resonator comprises an inductor and a capacitor. The inductor comprises a first terminal and a second terminal. The second terminal of the inductor is electrically coupled to a first terminal of the capacitor. A second terminal of the capacitor is electrically coupled to a first terminal of the Josephson junction. The terminal shared by the inductor and the capacitor is configured to be electrically coupled to an alternating current (AC) voltage source having a particular frequency and particular phase. The inductance of the inductor and the capacitance of the capacitor are selected to cause the resonator to resonate at a frequency and a phase that substantially match the particular frequency and the particular phase, respectively, of the AC voltage source to facilitate switching a state of the Josephson junction via a single flux quantum (SFQ) pulse.

Resonant LC Power Network for Superconducting Digital Circuits
20230208400 · 2023-06-29 ·

A superconducting circuit comprises a resonator and a Josephson junction. The resonator comprises an inductor and a capacitor. The inductor comprises a first terminal and a second terminal. The second terminal of the inductor is electrically coupled to a first terminal of the capacitor. A second terminal of the capacitor is electrically coupled to a first terminal of the Josephson junction. The terminal shared by the inductor and the capacitor is configured to be electrically coupled to an alternating current (AC) voltage source having a particular frequency and particular phase. The inductance of the inductor and the capacitance of the capacitor are selected to cause the resonator to resonate at a frequency and a phase that substantially match the particular frequency and the particular phase, respectively, of the AC voltage source to facilitate switching a state of the Josephson junction via a single flux quantum (SFQ) pulse.

ROBUST WAVEGUIDE MILLIMETER WAVE NOISE SOURCE
20170359028 · 2017-12-14 ·

Aspects of the present disclosure involve a system and method for generating noise waves at millimeter wave frequencies. A noise source generator is designed to be connected to a crystalline structure for efficient heat transfer and compatibility with millimeter wave receivers. The use of crystalline structure coupled to the noise source generator allows heat from a biasing device, such as a diode, to be carried away such that the diode is able to generate noise waves while being reversed biased without compromising the device. In another embodiment, the noise source generator includes the use of a backshort transmission line with vias that is connected to the biasing device for heat transfer from the biasing device to the backshort.

ELECTRICAL PULSE COMPRESSION CIRCUIT
20230170886 · 2023-06-01 · ·

A rectangular electrical pulse enters a transmission line structure with single pass transit time equal to ½ the duration of the pulse, open circuit at the extreme end and a switch at its center. After a delay equal to ¾ of the rectangular pulse duration the central switch is closed to couple the contents of the transmission line structure into another transmission line of half impedance. The output pulse maintains the initial voltage, but is of half the initial duration, and double the initial power.

ELECTRICAL PULSE COMPRESSION CIRCUIT
20230170886 · 2023-06-01 · ·

A rectangular electrical pulse enters a transmission line structure with single pass transit time equal to ½ the duration of the pulse, open circuit at the extreme end and a switch at its center. After a delay equal to ¾ of the rectangular pulse duration the central switch is closed to couple the contents of the transmission line structure into another transmission line of half impedance. The output pulse maintains the initial voltage, but is of half the initial duration, and double the initial power.

RADIO FREQUENCY CIRCUIT, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
20220052670 · 2022-02-17 ·

A filter allows a transmission signal in a predetermined frequency band to pass from a second input-output terminal to a first input-output terminal and allows a reception signal in the predetermined frequency band to pass from the first input-output terminal to the second input-output terminal. A first common terminal of a first switch is connected to the second input-output terminal. A second terminal and a first terminal of the first switch are exclusively connectable to the first common terminal. A second common terminal of a second switch is connected to a ground terminal of the filter. A second selection terminal and a first selection terminal of the second switch are exclusively connected to the second common terminal. Of the first selection terminal and the second selection terminal, only the first selection terminal is connected to a ground with a reactive element interposed therebetween.

RADIO FREQUENCY CIRCUIT, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
20220052670 · 2022-02-17 ·

A filter allows a transmission signal in a predetermined frequency band to pass from a second input-output terminal to a first input-output terminal and allows a reception signal in the predetermined frequency band to pass from the first input-output terminal to the second input-output terminal. A first common terminal of a first switch is connected to the second input-output terminal. A second terminal and a first terminal of the first switch are exclusively connectable to the first common terminal. A second common terminal of a second switch is connected to a ground terminal of the filter. A second selection terminal and a first selection terminal of the second switch are exclusively connected to the second common terminal. Of the first selection terminal and the second selection terminal, only the first selection terminal is connected to a ground with a reactive element interposed therebetween.

High-frequency module
11245386 · 2022-02-08 · ·

A high-frequency module includes a semiconductor chip device that is mounted on an external circuit substrate by wire bonding. A switch forming section, a power amplifier forming section and a low noise amplifier forming section, realized by a group of FETs, which are active elements, are formed in the semiconductor chip device. Flat plate electrodes, which form capacitors are formed in the semiconductor chip device. Conductor wires that connect the external circuit substrate and the semiconductor chip device function as inductors. A group of passive elements that includes inductors and capacitors is formed. As a result, a high-frequency module that can be reduced in size while still obtaining the required transmission characteristic is realized.

High-frequency module
11245386 · 2022-02-08 · ·

A high-frequency module includes a semiconductor chip device that is mounted on an external circuit substrate by wire bonding. A switch forming section, a power amplifier forming section and a low noise amplifier forming section, realized by a group of FETs, which are active elements, are formed in the semiconductor chip device. Flat plate electrodes, which form capacitors are formed in the semiconductor chip device. Conductor wires that connect the external circuit substrate and the semiconductor chip device function as inductors. A group of passive elements that includes inductors and capacitors is formed. As a result, a high-frequency module that can be reduced in size while still obtaining the required transmission characteristic is realized.