H03J2200/39

Method for tuning an antenna with a DVC

The present disclosure generally relates to any device capable of wireless communication, such as a mobile telephone or wearable device, having one or more antennas. After measuring reflection coefficients of a device at three different DVC states, the reflection coefficient for all other DVC states can be calculated. Thus, based solely upon three reflection coefficient measurements, the antenna can be tuned to adjust for any changes in impedance at the antenna.

METHOD FOR TUNING AN ANTENNA WITH A DVC

The present disclosure generally relates to any device capable of wireless communication, such as a mobile telephone or wearable device, having one or more antennas. After measuring reflection coefficients of a device at three different DVC states, the reflection coefficient for all other DVC states can be calculated. Thus, based solely upon three reflection coefficient measurements, the antenna can be tuned to adjust for any changes in impedance at the antenna.

Reconfigurable allocation of VNCAP inter-layer vias for co-tuning of L and C in LC tank

Techniques for co-tuning of inductance (L) and capacitance (C) in a VNCAP-based LC tank oscillator are provided. In one aspect, an LC tank oscillator includes: a capacitor including at least two metal layers, each metal layer having metal fingers that are interdigitated, wherein an orientation of the metal fingers alternates amongst the at least two metal layers; and an inductor on the capacitor. Inter-layer vias can be present interconnecting the at least two metal layers creating conductive loops between the metal fingers, wherein an arrangement of the inter-layer vias in an area between the at least two metal layers is configured to co-tune both inductance and capacitance in the LC tank oscillator. A method of operating an LC tank oscillator and a method of co-tuning inductance and capacitance in an LC tank oscillator are also provided.

Reconfigurable Allocation of VNCAP Inter-layer Vias for Co-Tuning of L and C in LC Tank
20190334477 · 2019-10-31 ·

Techniques for co-tuning of inductance (L) and capacitance (C) in a VNCAP-based LC tank oscillator are provided. In one aspect, an LC tank oscillator includes: a capacitor including at least two metal layers, each metal layer having metal fingers that are interdigitated, wherein an orientation of the metal fingers alternates amongst the at least two metal layers; and an inductor on the capacitor. Inter-layer vias can be present interconnecting the at least two metal layers creating conductive loops between the metal fingers, wherein an arrangement of the inter-layer vias in an area between the at least two metal layers is configured to co-tune both inductance and capacitance in the LC tank oscillator. A method of operating an LC tank oscillator and a method of co-tuning inductance and capacitance in an LC tank oscillator are also provided.

MEMS device with large out-of-plane actuation and low-resistance interconnect and methods of use

The present application is directed to a MEMS device. The MEMS device includes a substrate having a first end and a second end extending along a longitudinal axis, the substrate including an electrostatic actuator. The device also includes a movable plate having a first end and a second end. The device also includes a thermal actuator having a first end coupled to the first end of the substrate and a second end coupled to the first end of the plate. The actuator moves the plate in relation to the substrate. Further, the device includes a power source electrically coupled to the thermal actuator and the substrate. The application is also directed to a method for operating a MEMS device.

Widely tunable cavity filter using low voltage, large out-of-plane actuation MEMS

The present application is directed to a tunable filter system. The system includes a resonator having an inner wall surrounding a cavity. The resonator includes a MEMS device positioned in the cavity including a substrate, a movable plate and a thermal actuator. The thermal actuator is has a first end coupled to the substrate and a second end coupled to the plate. The actuator moves the plate between a first and a second position in relation to the substrate. The application is also directed to a method for operating the tunable filter.

Method and technique to control MEMS DVC control waveform for lifetime enhancement

The present invention generally relates to a method of operating a MEMS DVC while minimizing impact of the MEMS device on contact surfaces. By reducing the drive voltage upon the pull-in movement of the MEMS device, the acceleration of the MEMS device towards the contact surface is reduced and thus, the impact velocity is reduced and less damage of the MEMS DVC device occurs.

WIDELY TUNABLE CAVITY FILTER USING LOW VOLTAGE, LARGE OUT-OF-PLANE ACTUATION MEMS

The present application is directed to a tunable filter system. The system includes a resonator having an inner wall surrounding a cavity. The resonator includes a MEMS device positioned in the cavity including a substrate, a movable plate and a thermal actuator. The thermal actuator is has a first end coupled to the substrate and a second end coupled to the plate. The actuator moves the plate between a first and a second position in relation to the substrate. The application is also directed to a method for operating the tunable filter.

MEMS DEVICE WITH LARGE OUT-OF-PLANE ACTUATION AND LOW-RESISTANCE INTERCONNECT AND METHODS OF USE

The present application is directed to a MEMS device. The MEMS device includes a substrate having a first end and a second end extending along a longitudinal axis, the substrate including an electrostatic actuator. The device also includes a movable plate having a first end and a second end. The device also includes a thermal actuator having a first end coupled to the first end of the substrate and a second end coupled to the first end of the plate. The actuator moves the plate in relation to the substrate. Further, the device includes a power source electrically coupled to the thermal actuator and the substrate. The application is also directed to a method for operating a MEMS device.