Patent classifications
H03K17/002
Multiple-state electrostatically-formed nanowire transistors
A transistor (100), including a planar semiconducting substrate (36), a source (42) formed on the substrate, a first drain (102) formed on the substrate, and a second drain (104) formed on the substrate in a location physically separated from the first drain. At least one gate (38, 40) is formed on the substrate and is configured to selectably apply an electrical potential to the substrate in either a first spatial pattern, which causes a first conductive path (62) to be established within the substrate from the source to the first drain, or a second spatial pattern, which causes a second conductive path to be established within the substrate from the source to the second drain.
Multiple state electrostatically formed nanowire transistors
A transistor (100), including a planar semiconducting substrate (36), a source (42) formed on the substrate, a first drain (102) formed on the substrate, and a second drain (104) formed on the substrate in a location physically separated from the first drain. At least one gate (38, 40) is formed on the substrate and is configured to selectably apply an electrical potential to the substrate in either a first spatial pattern, which causes a first conductive path (62) to be established within the substrate from the source to the first drain, or a second spatial pattern, which causes a second conductive path to be established within the substrate from the source to the second drain.
ULTRASOUND TRANSMIT-RECEIVE SWITCH WITH COMBINED TRANSMIT-RECEIVE AND RETURN-TO-ZERO PATH
An ultrasound system includes a transmit-receive switch. The transmit-receive switch includes a combined transmit-receive and return-to-zero (RTZ) path. The combined transmit-receive and RTZ path includes a transistor with a first current terminal, a second current terminal, and a control terminal. The second current terminal of the transistor is coupled to a ground node via a first switch and is coupled to a receive node via a second switch. The ultrasound system also includes a receiver front-end circuit coupled to the receive node.
Channel switchover power multiplexer circuits, and methods of operating the same
Channel switchover power multiplexer circuits, and methods of operating the same are disclosed. An example power multiplexer a first transistor coupled to a first input, a second transistor coupled to the first transistor to couple a first voltage at the first input to an output, a third transistor coupled to a second input, a fourth transistor coupled to the third transistor to couple a second voltage at the second input to the output, a diode amplifier to provide a third voltage to a gate of the first transistor to block a reverse current, and a soft-start amplifier to provide a fourth voltage to a gate of the fourth transistor to turn on (with adjustable VOUT ramp rate) the fourth transistor with a constant ramp rate.
RF switch with bypass topology
An RF signal switch circuit that allows connection of any of N radio frequency (RF) input terminals to a switch output port, either in a low loss mode, in a bypass mode, or, optionally, in a signal function mode. Embodiments of the invention allow for both a single switch in the series input path to a target circuit while still having the ability to isolate the bypass path from the target circuit. In the low loss and bypass mode, the circuit simultaneously exhibits low input insertion loss (and thus a low noise factor) and high bypass mode isolation.
MULTIPLEXER AND METHOD FOR DRIVING THE SAME
A multiplexer is provided herein. The multiplexer has a plurality of first driving units and a plurality of second driving units. Each of the first driving units has a first data voltage input terminal, and each of the second driving units has a second data voltage input terminal. The first data voltage input terminal and the second data voltage input terminal are configured to receive pixel voltage signals with different polarities. In the first driving unit, a voltage difference between a gate and a drain of a transistor is controlled by a first reset signal, wherein the transistor of the first driving unit is coupled to the first data voltage input terminal and a first data line. In the second driving unit, a voltage difference between a gate and a drain of a transistor is controlled by a second reset signal, wherein the transistor of the second driving unit is coupled to the second data voltage input terminal and a second data line.
TRANSMISSION GATE STRUCTURE, LAYOUT, METHODS, AND SYSTEM
A transmission gate structure includes first and second PMOS transistors in a first active area and first and second NMOS transistors in a second active area. The first and second PMOS transistors include first and second gate structure, the first NMOS transistor includes a third gate structure coupled to the second gate structure, and the second NMOS transistor includes a fourth gate structure coupled to the first gate structure. A first metal zero segment overlies the first active area, a second metal zero segment is offset from the first metal zero segment by an offset distance, a third metal zero segment is offset from the second metal zero segment by the offset distance, and a fourth metal zero segment is offset from the third metal zero segment by the offset distance and overlies the second active area.
GaN BASED ADJUSTABLE DRIVER CURRENT CIRCUIT
A circuit for providing an adjustable output driver current for use in LiDAR or other similar GaN driver applications. The circuit creates an appropriate gate-to-source voltage, V.sub.GS, for a high-current GaN driver FET to obtain a desired, high slew-rate driver current, I.sub.DRV. An externally provided reference current is used to create the required V.sub.GS for the driver FET, which is stored on an external capacitor. The value of the capacitor far exceeds the relatively low input-capacitance of the GaN driver FET. When a pulse I.sub.DRV of desired value is needed, the voltage on the capacitor is impinged upon the gate of the driver FET, thereby creating the desired I.sub.DRV. The reference charging circuit replenishes any charge lost on the capacitor, so that the same desired I.sub.DRV can be obtained on the next command pulse.
HIGH DENSITY ANALOG MULTIPEXING
Systems, methods, and devices include a high-density analog multiplexer topology. Such topologies can be used, for example, in sensor device applications. An analog multiplexer circuit can include circuitry to receive N input signals; and circuitry to generate N selection signals for selecting one of said N data signals to be output from said analog multiplexer circuit. The analog multiplexer comprises one or more analog impedances.
CHANNEL SWITCHOVER POWER MULTIPLEXER CIRCUITS, AND METHODS OF OPERATING THE SAME
Channel switchover power multiplexer circuits, and methods of operating the same are disclosed. An example power multiplexer a first transistor coupled to a first input, a second transistor coupled to the first transistor to couple a first voltage at the first input to an output, a third transistor coupled to a second input, a fourth transistor coupled to the third transistor to couple a second voltage at the second input to the output, a diode amplifier to provide a third voltage to a gate of the first transistor to block a reverse current, and a soft-start amplifier to provide a fourth voltage to a gate of the fourth transistor to turn on (with adjustable VOUT ramp rate) the fourth transistor with a constant ramp rate.