H03L1/02

Drift compensation

The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

FREQUENCY-LOCKED LOOP AND METHOD FOR CORRECTING OSCILLATION FREQUENCY OF OUTPUT SIGNAL OF FREQUENCY-LOCKED LOOP
20220399897 · 2022-12-15 · ·

A frequency-locked loop (FLL) and a method for correcting an oscillation frequency of an output signal of the FLL are provided. The FLL includes a switched capacitor circuit, a first resistor set, a second resistor set, a determination circuit and a control circuit. The switched capacitor circuit includes a capacitor, and connection of the capacitor is switched according to the oscillation frequency. The first resistor set is configured to provide a first resistance, and the second resistor set is configured to provide a second resistance. The determination circuit is configured to generate a determination result according to the first resistance and the second resistance. The control circuit is configured to generate a control signal for correcting the first resistance and the second resistance according to the determination result, where the oscillation frequency is determined based on the capacitor and at least one of the first resistance and the second resistance.

REAL-TIME CORRECTION METHOD FOR OVEN CONTROLLED CRYSTAL OSCILLATOR AND ELECTROMAGNETIC RECEIVER

The present disclosure provides a real-time correction method for an Oven Controlled Crystal (Xtal) Oscillator (OCXO) and an electromagnetic receiver. The real-time correction method for an OCXO includes: performing frequency multiplication on a reference clock signal to generate a first measurement signal and a second measurement signal; identifying a rising edge of each pulse per second on the basis of the first measurement signal to obtain a gate time T; obtaining a frequency of the second measurement signal according to the gate time T; and adjusting a frequency of the reference clock signal at least on the basis that an absolute value of a difference between two adjacent frequencies obtained of the second measurement signal is greater than a standard frequency difference.

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle
11509288 · 2022-11-22 · ·

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Integrated circuit, oscillator, electronic apparatus, and vehicle
11509265 · 2022-11-22 · ·

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

Integrated circuit, oscillator, electronic apparatus, and vehicle
11509265 · 2022-11-22 · ·

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

Temperature-controlled oscillating device
11509311 · 2022-11-22 · ·

A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.

Semiconductor package structure and method of manufacturing the same

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Server data sending method and apparatus

Embodiments of the present disclosure provide a server data sending method and a server data sending apparatus. The method can include: acquiring, by a server, crystal oscillator error information and operating rate information of a terminal; setting, by the server, preamble length information according to the crystal oscillator error information and the operating rate information; and sending, by the server, a downlink data frame to the terminal, the downlink data frame comprising a preamble aligned with the preamble length information.

PHASE-LOCKED LOOP CIRCUIT, CONFIGURATION METHOD THEREFOR, AND COMMUNICATION APPARATUS
20220360267 · 2022-11-10 ·

Provided is a phase-locked loop circuit, a method for configuring the same, and a communication device. The phase-locked loop circuit includes a phase-locked loop main circuit and a phase temperature compensation circuit. The phase temperature compensation circuit includes at least one phase delay unit connected to the phase-locked loop main circuit and configured to generate a phase shift as a result of a temperature change for cancelling out a phase shift generated by the phase-locked loop main circuit as a result of a temperature change.