Processing a received optical signal in an optical communication network includes equalizing a received optical signal to provide an equalized signal, demodulating the equalized signal according to an m-ary modulation format to provide a demodulated signal, decoding the demodulated signal according to an inner code to provide an inner-decoded signal, and decoding the inner-decoded signal according to an outer code. Other aspects include other features such as equalizing an optical channel including storing channel characteristics for the optical channel associated with a client, loading the stored channel characteristics during a waiting period between bursts on the channel, and equalizing a received burst from the client using the loaded channel characteristics.

Components formed from colored glass-based materials are disclosed. A cover member formed from a colored glass-based material may be positioned over one or more device components such as a component of a wireless communication or charging system. The cover member may have optical properties, electrical properties, magnetic properties, and/or mechanical properties compatible with the requirements of the one or more device components. In some cases, different portions of the cover member may be configured to have different optical and/or electrical properties.

A cryogenic system cools and operates cryogenic electronics. The cryogenic system includes a cryogenic stage or multiple cryogenic stages for cooling the cryogenic electronics to an operational cryogenic temperature. The cryogenic stage or stages transfer heat from the cryogenic electronics to an ambient environment. An optical fiber or multiple optical fibers deliver an operational power from the ambient environment to the cryogenic electronics and transfer communication data between the cryogenic electronics and the ambient environment. Preferably, the only connection delivering any power from the ambient environment to the cryogenic electronics or transferring any data from the cryogenic electronics to the ambient environment is the optical fiber or fibers, such that the cryogenic system does not include any electrically conductive wires spanning between the ambient environment and the cryogenic electronics.

A cryogenic system cools and operates cryogenic electronics. The cryogenic system includes a cryogenic stage or multiple cryogenic stages for cooling the cryogenic electronics to an operational cryogenic temperature. The cryogenic stage or stages transfer heat from the cryogenic electronics to an ambient environment. An optical fiber or multiple optical fibers deliver an operational power from the ambient environment to the cryogenic electronics and transfer communication data between the cryogenic electronics and the ambient environment. Preferably, the only connection delivering any power from the ambient environment to the cryogenic electronics or transferring any data from the cryogenic electronics to the ambient environment is the optical fiber or fibers, such that the cryogenic system does not include any electrically conductive wires spanning between the ambient environment and the cryogenic electronics.

A tap coupler includes a mode generation unit, a separation unit, and an output unit. The mode generation unit generates, in accordance with a discontinuous portion disposed on a travelling path of signal light that is propagating, a first mode of the signal light and a second mode that is different from the first mode. The separation unit separates, when the first mode and the second mode are input from the mode generation unit, the first mode and the second mode. The output unit outputs branch light in accordance with a transition of the second mode received from the separation unit.

A tap coupler includes a mode generation unit, a separation unit, and an output unit. The mode generation unit generates, in accordance with a discontinuous portion disposed on a travelling path of signal light that is propagating, a first mode of the signal light and a second mode that is different from the first mode. The separation unit separates, when the first mode and the second mode are input from the mode generation unit, the first mode and the second mode. The output unit outputs branch light in accordance with a transition of the second mode received from the separation unit.

An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.

Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.

An integrated pluggable optical tap module configured to be coupled to a host interface of a network equipment for tapping a signal of an optical transport link comprises a first, a second optical interface, and an active optical receiver. The optical pluggable module also includes a passive optical tap for splitting a signal received from the first optical interface and transmitting the signal on the second optical interface and a copy of the signal to the active optical receiver. The active optical receiver converts said signal to an electrical signal for transmission to the host interface.