Patent classifications
H04N23/57
Enhanced pointing angle validation
Devices, systems, and methods are provided for enhanced pointing angle validation. A device may generate a collimated beam using a light source emitting a light beam through a fiducial target in an optical instrument. The device may capture an image fiducial target using a camera, wherein the camera is mounted on a mounting datum that is orthogonal to the collimated beam. The device may determine a pointing angle associated with camera based on the captured image of the fiducial target. The device may compare a location of the fiducial target in the image to an optical center of the camera. The device may determine a validation status of camera based on the location of the fiducial target in the image.
Periscope optical module
A periscope optical module is provided. The periscope optical module includes a first optical element, a second optical element, and a third optical element. The first optical element has a first optical axis. The second optical element corresponds to the first optical element and adjusts a forward direction of a light. The third optical element has a second optical axis. The third optical element corresponds to the second optical element. The light passes through the first optical element, the second optical element, and the third optical element consecutively. The first optical axis is not parallel to the second optical axis. A minimum size of the first optical element in a direction that is perpendicular to the first optical axis is larger than a maximum size of the third optical element in a direction of the first optical axis.
Hybrid sensor shift platform
A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.
Camera module with improved heat dissipation function and electronic device
The camera module with improved heat dissipation function include a base, a photosensitive chip, a circuit board; and a heat conducting sheet. Wherein the base comprises a first surface and a second surface opposite to the first surface. A portion of the first surface is recessed to form a third surface between the first surface and the second surface, and to form a plurality of sidewalls connecting the first surface and the third surface, the third surface and the plurality of sidewalls cooperatively define a slot. Wherein the photosensitive chip is fixed on the third surface and accommodated in the slot; the circuit board is fixed on the first surface. A gap is defined between the circuit board and the photosensitive chip; the heat conducting sheet is disposed in the gap.
Camera module of reduced size in two dimensions and electronic device including the same
A camera module miniaturized in both width and length includes a baseplate, a lens assembly, and a bracket. The bracket includes a support plate and a support member disposed on the support plate. The support plate includes a first surface facing away from the baseplate and a second surface facing the baseplate. The support plate defines a first opening penetrating the first surface and the second surface. The lens assembly is disposed on the first surface and completely covers the first opening. The support member is located between the support plate and the baseplate. The support member includes a first support portion and a plurality of second support portions arranged at intervals, the first support portion is disposed on the second surface and surrounds the peripheral edge of the first opening. Each second support portion extends outwards from an outer surface of the first support portion.
ELECTRONIC DEVICE
The embodiments of the present application disclose an electronic device, and the electronic device includes: a device body and a camera apparatus, where a sound-emitting device is installed in the device body, a first sound cavity is provided on the device body, the first sound cavity has an opening that communicates with the outside, the camera apparatus is detachably installed in the first sound cavity, in a case that the camera apparatus is installed in the first sound cavity, the sound cavity of the sound-emitting device has a first volume value, in a case that the camera apparatus is separated from the device body, the sound cavity of the sound-emitting device extends toward the first sound cavity and has a second volume value, and the first volume value is smaller than the second volume value.
ELECTRONIC APPARATUS
The present disclosure provides an electronic apparatus capable of capturing an image without being affected by an abnormality on a display surface.
The electronic apparatus includes: a display unit; an imaging unit that is disposed on an opposite side to a display surface of the display unit; an abnormality detection unit that detects an abnormality on the display surface; and a display control unit that highlights a position where the abnormality detected by the abnormality detection unit occurs on the display unit.
OPTICAL COMPONENT DRIVING MECHANISM
An optical component driving mechanism is provided. The optical component driving mechanism includes a first movable portion, a fixed portion, a first circuit member, and a first reinforcing component. The first movable portion is connected to the first optical component. The first optical component has a first optical axis. The first movable portion is movable relative to the fixed portion. The first circuit member is disposed on the fixed portion, and the first circuit member is configured to transmit electrical signals. The first reinforcing component is disposed on the first circuit member.
FOLDED CAMERA WITH CONTINUOUSLY ADAPTIVE ZOOM FACTOR
Folded Tele cameras comprising an optical path folding element (OPFE) for folding a first optical path OP1 to a second optical path OP2, a lens including N=8 lens elements, the lens being divided into three lens groups numbered, in order from an object side of the lens, G1, G2 and G3, and an image sensor, wherein G1 and G3 are included in a single G13 carrier, wherein G2 is included in a G2 carrier, wherein both the G13 carrier and the G2 carrier include rails for defining the position of G2 relative to G13, wherein the Tele camera is configured to change a zoom factor continuously between a minimum zoom factor ZF.sub.MIN and a maximum zoom factor ZF.sub.MAX by moving the G2 carrier relative to the G13 carrier and by moving the G13 carrier relative to the image sensor, and wherein an effective focal length (EFL) is 7.5 mm<EFL<50 mm. The G2 carrier may be positioned by a lens transporter within the G13 carrier at a particular zoom factor to form a lens pair to enable optical investigation and/or transporting of the lens pair.
ELECTRONIC APPARATUS AND ACCESSORY
An electronic apparatus to which an accessory is to be detachably attached includes a plurality of contacts electrically connectable to the accessory and arranged in a first direction orthogonal to an attachment direction of the accessory. The plurality of contacts include an attachment detection contact that is used to detect an attachment of the accessory to the electronic apparatus, and a first clock contact that is used to communicate a first clock signal in communication between the electronic apparatus and the accessory. A potential of the attachment detection contact changes from a predetermined potential to a reference potential different from the predetermined potential after the accessory is attached to the electronic apparatus. The attachment detection contact is disposed next to the first clock contact.