A photoelectric conversion device includes a light receiving circuit configured to convert light into an electrical signal, a first hold circuit configured to hold a data signal which represents the electrical signal, a second hold circuit configured to hold a noise signal read out from the light receiving circuit in a reset state, a first resistive element to which a voltage corresponding to a difference between the data signal held by the first hold circuit and the noise signal held by the second hold circuit is applied, an A/D converter configured to convert an analog current flowing in the first resistive element into digital data, a second resistive element, and a temperature detection circuit configured to generate, based on a current flowing in the second resistive element, an analog output corresponding to an internal temperature of the photoelectric conversion device.

A photoelectric conversion device includes a light receiving circuit configured to convert light into an electrical signal, a first hold circuit configured to hold a data signal which represents the electrical signal, a second hold circuit configured to hold a noise signal read out from the light receiving circuit in a reset state, a first resistive element to which a voltage corresponding to a difference between the data signal held by the first hold circuit and the noise signal held by the second hold circuit is applied, an A/D converter configured to convert an analog current flowing in the first resistive element into digital data, a second resistive element, and a temperature detection circuit configured to generate, based on a current flowing in the second resistive element, an analog output corresponding to an internal temperature of the photoelectric conversion device.

A radiation image capturing apparatus includes scan lines, signal lines, radiation detection elements, bias lines, a readout IC, a control unit and a noise detection unit. The detection elements generate electric charges by receiving radiation. The readout IC reads respective image data based on the respective electric charges. The control unit controls at least the readout IC. At the time when each image data is read, the detection unit outputs data based on voltage noise in reverse bias voltage applied to the detection elements via the bias lines and/or voltage noise in off voltage applied to the scan lines. The control unit estimates an offset component in the output data, calculates noise data based on the output data and the offset component and subtracts the noise data from the image data, thereby generating corrected image data.

There is provided an image processing device including a light sensor and a processor. The light sensor is used to detect light and output an image frame. The processor identifies intensity of ambient light according to an image parameter associated with the image frame. When the ambient light is identified to be strong enough, the processor performs an object identification directly using the image frame. When the ambient light is identified to be not enough, the processor firstly converts the image frame to a converted image using a machine learning model, and then performs the object identification using the converted image.

There is provided an image processing device including a light sensor and a processor. The light sensor is used to detect light and output an image frame. The processor identifies intensity of ambient light according to an image parameter associated with the image frame. When the ambient light is identified to be strong enough, the processor performs an object identification directly using the image frame. When the ambient light is identified to be not enough, the processor firstly converts the image frame to a converted image using a machine learning model, and then performs the object identification using the converted image.

Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. An imaging device in accordance with one embodiment of the invention includes at least one imager array, and each imager in the array comprises a plurality of light sensing elements and a lens stack including at least one lens surface, where the lens stack is configured to form an image on the light sensing elements, control circuitry configured to capture images formed on the light sensing elements of each of the imagers, and a super-resolution processing module configured to generate at least one higher resolution super-resolved image using a plurality of the captured images.

Visibility of a license plate and color reproducibility of a vehicle body are improved in a monitoring camera.

A vehicle body area detection unit detects a vehicle body area of a vehicle from an image signal. A license plate area detection unit detects a license plate area of the vehicle from the image signal. A vehicle body area image processing unit performs processing of the image signal corresponding to the detected vehicle body area. A license plate area image processing unit performs processing different from the processing of the image signal corresponding to the vehicle body area on the image signal corresponding to the detected license plate area. A synthesis unit synthesizes the processed image signal corresponding to the vehicle body area and the processed image signal corresponding to the license plate area.

An X-ray detector includes a detection unit to convert X-rays into a signal value and an evaluation unit. The detection unit and the evaluation unit are configured in a common component, the extent of the component along a first direction being not greater than the extent of the detection unit. The evaluation unit includes at least one correction unit to correct the signal values, a computation unit to control the correction, and a memory unit to store at least one correction parameter. The evaluation unit is designed such that the signal values are corrected as a function of the at least one correction parameter. A method and detector group are also disclosed.

An image sensor pixel noise measurement circuit includes a pixel array on an integrated circuit chip. The pixel array includes a plurality of pixels including a first pixel to output a first image data signal, and a second pixel to output a second image data signal. A noise amplification circuit on the integrated circuit chip is coupled to receive the first and second image data signals from the pixel array. The noise amplification circuit is coupled to output an amplified differential noise signal in response to the first and second image data signals received from the pixel array. A fast Fourier transform (FFT) analysis circuit on the integrated circuit chip is coupled to transform the amplified differential noise signal output by the noise amplification circuit from a time domain to a frequency domain to analyze a pixel noise characteristic of the pixel array.

An imaging sensor is configured to generate a signal that is obtained by amplifying one of a signal corresponding to a first accumulation period and a signal corresponding to a second accumulation period by using amplification factors having different values.