In a solid-state imaging element that measures a distance, distance measurement accuracy is improved.

The solid-state imaging element includes a photon number detection unit, a histogram generation unit, and a distance measurement unit. The photon number detection unit detects the number of photons incident on a pixel array unit over a predetermined number of times and outputs a detection result including the number of photons and a detection timing. The histogram generation unit generates, for each number of photons, a histogram indicating a detection frequency of the number of photons as a frequency for each detection timing, on the basis of the detection result. The distance measurement unit measures a distance to a predetermined object on the basis of the histogram generated.

There are provided a solid-state imaging device capable of improving quantum efficiency while suppressing occurrence of color mixture, and a method of manufacturing such a solid-state imaging device. According to the present disclosure, a solid-state imaging device (100, 100a, 100b, 100c) is provided. The solid-state imaging device (100, 100a, 100b, 100c) includes a first region (4, 4a, 4b) and a second region (5, 5a) in a light receiving surface of an imaging pixel (1, 1a, 1b, 1c). The first region (4, 4a, 4b) is provided with unevenness. The second region (5, 5a) is provided with unevenness having a pitch narrower than that of the unevenness in the first region (4, 4a, 4b).

A light receiving device (3) includes a first circuit substrate (10) and a second circuit substrate (20). An avalanche photodiode (APD) (101) and a protection element (130) that protects the APD (101) are disposed on the first circuit substrate (10). The second circuit substrate (20) is stacked on the first circuit substrate (10), and a signal processing circuit that processes a signal output from the APD (101) is disposed on the second circuit substrate (20).

The present technology relates to a solid-state imaging device and an electronic apparatus capable of improving sensitivity while suppressing deterioration of color mixing. The solid-state imaging device includes a substrate, a first photoelectric conversion region in the substrate, a second photoelectric conversion region in the substrate, a trench between the first photoelectric conversion region and the second photoelectric conversion region and penetrates through the substrate, a first concave portion region that has a plurality of concave portions provided on a light receiving surface side of the substrate, above the first photoelectric conversion regions, and a second concave portion region that has a plurality of concave portions provided on the light receiving surface side of the substrate, above the second photoelectric conversion region. The technology of the present disclosure can be applied to, for example, a backside illumination solid-state imaging device and the like.

To provide a solid-state imaging device capable of improving image quality and an electronic apparatus equipped with the solid-state imaging device. There is provided a solid-state imaging device including a pixel array unit in which a plurality of pixels is one-dimensionally or two-dimensionally arrayed, the pixel array unit including a color filter and a semiconductor substrate for each pixel, a partition layer being formed between the color filters, the partition layer having a first width and a second width in order from a light incident side, the first width and the second width being different, and the second width being larger than the first width, and there is further provided an electronic apparatus equipped with the solid-state imaging device.

A multilayer film according to an embodiment of the present disclosure includes: semiconductor layers; and dielectric layers. In each of the semiconductor layers, a value of an optical constant k1 for light having a wavelength in a visible light region among optical constants k is larger than a value of an optical constant k2 for light having a wavelength in an infrared light region. The optical constants k each serves as an extinction coefficient that includes an imaginary part of a complex refractive index. The semiconductor layers and the dielectric layers are alternately stacked and the multilayer film has an optical distance of 0.3 μm or more and 10 μm or less in a stack direction and absorbs at least a portion of visible light and transmits infrared light.

An imaging device capable of image processing is provided. The imaging device has an image recognition function. In the imaging device, cells have a function of acquiring imaging data and a function of retaining weight data. Among the cells arranged in a matrix, some of the cells acquire imaging data and the rest of the cells retain weight data. Then, arithmetic operation is performed using the imaging data and the weight data. For example, all the imaging data can be subjected to arithmetic operation where products of the imaging data and the weight data are calculated and the sum of the calculated products is calculated. That is, product-sum operation can be performed. When an arithmetic operation result is captured by a neural network such as a convolutional neural network (CNN) or the like, the additional function can be used because image processing can be performed on the imaging data.

Reflected light from a back-illuminated photoelectric conversion element is to be reduced. The photoelectric conversion element includes an on-chip lens, a substrate, a front-surface-side reflective film, and a back-surface-side reflective film. The on-chip lens condenses incident light. A photoelectric conversion unit that performs photoelectric conversion on the condensed incident light is disposed in the substrate, and the back surface side of the substrate is irradiated with the condensed incident light. The front-surface-side reflective film is disposed on the front surface side that is a different side from the back surface side of the substrate, and reflects transmitted light that is the incident light having passed through the photoelectric conversion unit. The back-surface-side reflective film is disposed on the back surface side of the substrate, has an opening of substantially the same size as the condensing size of the condensed incident light, and further reflects the reflected transmitted light.

The present disclosure relates to a pixel sensing circuit in which a test is performed only on selected specific channels among channels of the pixel sensing circuit and the total test time of the pixel sensing circuit and data throughput for the test may be reduced.

An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.