H04R1/06

Sound Generator
20170289697 · 2017-10-05 ·

A sound generator is disclosed. The sound generator includes a frame including a side wall forming a storage space; a voice coil connected with the frame and accommodated in the storage space, the voice coil including a coil body and a coil lead extending from coil body. The coil lead includes a fixed portion connected to the coil body; an arc portion extending from the fixed portion and a projection of the arc portion along a direction perpendicular to a vibrating direction of the voice coil at least partially located within the voice coil body; and a connecting portion extending from the arc portion and connected with the sidewall.

Molded interconnect mircoelectromechanical system (MEMS) device package
09781519 · 2017-10-03 · ·

A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

Molded interconnect mircoelectromechanical system (MEMS) device package
09781519 · 2017-10-03 · ·

A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Wireless microphone with antenna therein

In a wireless microphone having an antenna in a lower part of a main body, a wireless microphone in which a microphone main body serves as a ground plane, which secures stable antenna ground by being gripped by a user, and which is capable of obtaining good RF performance is provided. The microphone main body includes a holder member made of metal for holding at least an antenna circuit part, a cylindrical cover member made of metal for covering a periphery of the holder member, and a cylindrical grip end member made of metal, inserted into a rear end side of the cover member, and connected with a rear part side of the holder member. The holder member has conduction with the cover member via the grip end member.

Loudspeaker unit
09743163 · 2017-08-22 · ·

A loudspeaker unit includes a voice coil, a diaphragm, a damper, a frame supporting an outer edge of the diaphragm and an outer edge of the damper, and a duct projecting from an outer surface of the frame, with air moved by vibration of the diaphragm flowing into and out of the loudspeaker unit through the duct. The frame has an aperture that communicates with a space inside the frame. The duct, serving as a separate member, is attached to the frame so as to cover the aperture. The frame further includes a support tab that projects into the aperture. Link terminals are attached to the support tab. Before the duct is attached to the frame, lead wires extending from the voice coil are formed into a predetermined shape and are then connected to the link terminals in a space within the aperture.

Loudspeaker unit
09743163 · 2017-08-22 · ·

A loudspeaker unit includes a voice coil, a diaphragm, a damper, a frame supporting an outer edge of the diaphragm and an outer edge of the damper, and a duct projecting from an outer surface of the frame, with air moved by vibration of the diaphragm flowing into and out of the loudspeaker unit through the duct. The frame has an aperture that communicates with a space inside the frame. The duct, serving as a separate member, is attached to the frame so as to cover the aperture. The frame further includes a support tab that projects into the aperture. Link terminals are attached to the support tab. Before the duct is attached to the frame, lead wires extending from the voice coil are formed into a predetermined shape and are then connected to the link terminals in a space within the aperture.

Acoustic diaphragm
09743190 · 2017-08-22 · ·

An acoustic diaphragm made at least in part from an expanded material. The expanded material includes one or more of cellulose, synthetic fibers and glass fibers. The expanded material has more than about 55% by volume voids.

CABLE MANAGEMENT SYSTEMS AND METHODS
20170233217 · 2017-08-17 ·

Cable-management systems can hold a speaker device and can hold at least a portion of an electrical cable of the speaker device. In some embodiments, a cable-management system includes a housing having an upper portion and a lower portion separated by at least one upward-facing surface configured to vertically support the speaker device. The upward-facing surface can be a ledge or a wall that stretches all the way across a cylindrical cable management system. The upper portion can hold the speaker device while the lower portion holds the electrical cable. The electrical cable can be wrapped around a post of the housing such that the cable is hidden inside the cable management system.