A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

This disclosure provides systems, methods, and apparatus related to acoustic transducers.

A microphone device, an interface circuit and method are provided for managing a potential difference in sensitivity to a detected environmental stimulus associated with a sensor arrangement, where multiple electrical signals forming a differential signal can be produced, and the multiple electrical signals can be better balanced. Such an interface circuit, which can be used within a microphone device includes a bias voltage generator having one or more bias output voltage terminals, where a respective one of one or more DC bias voltages is produced at each of the bias output voltage terminals, for being coupled to a pair of transduction elements of a sensor. The interface circuit further includes an amplifier circuit having a first input terminal coupled to a first one of the pair of output terminals of the sensor and having a second input terminal coupled to a second one of the pair of output terminals of the sensor, the amplifier circuit producing a differential output signal. The interface circuit still further includes a compensation circuit coupled to the amplifier circuit for producing a balance signal based on an output signal being produced by the amplifier circuit, wherein the balance signal compensates for any difference in amplitude in the first and second electrical signals that are received by the amplifier circuit from the sensor.

The invention provides a MEMS microphone. The MEMS microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A diaphragm is disposed within the second opening of the dielectric layer, wherein a peripheral region of the diaphragm is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer and covering over the second opening. The backplate layer includes a plurality of acoustic holes arranged into a regular array pattern. The regular array pattern comprises a pattern unit, the pattern unit comprises one of the acoustic holes as a center hole, and peripheral holes of the acoustic holes surrounding the center hole with a same pitch to the center hole.

A sound wave transducer is provided. The sound wave transducer includes a first board, a spacer layer and a second board over the first board and the spacer layer. The first board includes a carrier, a first substrate layer and a first metal layer. The carrier has a first opening formed in a central region. The first substrate layer is disposed on the carrier and over the first opening. The first metal layer is disposed on the first substrate layer. The spacer layer is disposed on the first board and surrounds the central region. The second board includes a second substrate layer, a second metal layer disposed on the spacer layer, and a plurality of second openings penetrating through the second substrate layer and the second metal layer.

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

This disclosure provides systems, methods, and apparatus related to an ultrasonic microphone and an ultrasonic acoustic radio. In one aspect a system includes a transmitter and a receiver. The receiver comprises a membrane. The membrane comprises a single layer or multiple layers of a two-dimensional material. The receiver is operable to receive sound waves in a frequency range, with the frequency range being the ultrasonic frequency range.

A charge pump having an input section, and first and second output charge pump sections. The input section includes an input and output node and N input charge pump cells arranged between the input and output nodes. The first output charge pump section includes a first input and output node and M first charge pump cells arranged between the first input and output nodes. The second output charge pump section includes a second input and output node and K second charge pump cells arranged between the second input and output nodes (M, N, K: any integer≥1). The output node of the input charge pump section is coupled with the first input node of the first output charge pump section and with the second input node of the second output charge pump section. The charge pump is configured to provide a first output voltage on the first output node and a second output voltage on the second output node.

A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.

A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.