The present invention provides a MEMS speaker including a substrate sidewall enclosing a cavity. The substrate sidewall includes a first surface and a second surface, a sounding assembly that is arranged on the first surface of the substrate sidewall and also seals the cavity at the opening of the first surface, and a bracket disposed in the cavity. The sounding assembly includes a first sounding assembly and the second sounding assembly. Each sounding assembly includes a driving part and a flexible diaphragm. The flexible diaphragm closes the gap formed between the free ends of adjacent driving parts and between the free ends of the driving parts and the substrate sidewall. The present invention also provides a manufacturing method of MEMS speaker. The MEMS speakers provided by the present invention have high-quality acoustic performance.

Ultrasonic transducers that are capable of generating increased levels of ultrasound, as well as receiving ultrasonic waves with increased sensitivity. The ultrasonic transducers include a back cover, a protective front cover, a backplate, and a vibrator film layer disposed between the backplate and the protective front cover. The backplate includes a plurality of grooves formed on a surface thereof facing the vibrator film layer. Each groove includes upper edges having cross-sectional contours that gradually tend toward the deepest part of the groove to allow a larger area of the backplate to be closer to the vibrator film layer, thereby increasing the resulting electric field, and, consequently, increasing the output power and sensitivity of the ultrasonic transducer.

Ultrasonic transducers that are capable of generating increased levels of ultrasound, as well as receiving ultrasonic waves with increased sensitivity. The ultrasonic transducers include a back cover, a protective front cover, a backplate, and a vibrator film layer disposed between the backplate and the protective front cover. The backplate includes a plurality of grooves formed on a surface thereof facing the vibrator film layer. Each groove includes upper edges having cross-sectional contours that gradually tend toward the deepest part of the groove to allow a larger area of the backplate to be closer to the vibrator film layer, thereby increasing the resulting electric field, and, consequently, increasing the output power and sensitivity of the ultrasonic transducer.

An earphone includes a resonance circuit that outputs an adjusted signal obtained by making a signal component of a predetermined frequency contained in an electric signal outputted from a sound source device larger than a signal component of another frequency, a fixed electrode that is fixed to a housing, a diaphragm that is provided facing the fixed electrode and that vibrates according to a potential difference generated between the diaphragm and the fixed electrode on the basis of the adjusted signal, a contact part that contacts a partial region of the diaphragm and presses the partial region against the fixed electrode, and a sound emitting part that emits sound generated by vibration of the diaphragm to the outside of the housing.

An earphone includes a resonance circuit that outputs an adjusted signal obtained by making a signal component of a predetermined frequency contained in an electric signal outputted from a sound source device larger than a signal component of another frequency, a fixed electrode that is fixed to a housing, a diaphragm that is provided facing the fixed electrode and that vibrates according to a potential difference generated between the diaphragm and the fixed electrode on the basis of the adjusted signal, a contact part that contacts a partial region of the diaphragm and presses the partial region against the fixed electrode, and a sound emitting part that emits sound generated by vibration of the diaphragm to the outside of the housing.

A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.

A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.

A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.

A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.

A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.