Patent classifications
H04R19/02
MEMS Microphone
The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.
MEMS Microphone
The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.
Electrostatic headphone with integrated amplifier
An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the transducer, and a high voltage power supply electrically coupled to the high voltage amplifier. At least one of the ear cup assemblies further comprises a power source for providing electric power to the high voltage power supply included in the at least one ear cup assembly. In some cases, one or more of the ear cup assemblies further comprises a wireless communication module for receiving audio signals from an audio source.
Electrostatic headphone with integrated amplifier
An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the transducer, and a high voltage power supply electrically coupled to the high voltage amplifier. At least one of the ear cup assemblies further comprises a power source for providing electric power to the high voltage power supply included in the at least one ear cup assembly. In some cases, one or more of the ear cup assemblies further comprises a wireless communication module for receiving audio signals from an audio source.
SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.
Loudspeaker with array of electrostatic card stack drivers
Dipole audio speakers, and more particularly, voice controlled dipole audio speakers having at least one microphone located substantially along the null sound plane of the dipole audio speaker. An improved loudspeaker system that produces an improved audio quality for stereophonic sound. The improved loudspeaker utilizes conventional electro-dynamic drivers in a sealed chamber that produce sound primarily in the 20-300 Hz band coupled with electrostatic card stack drivers placed outside the sealed chamber that cover the remaining 98% of the audio frequency spectrum (300 Hz to 20 kHz). The improved loudspeaker system can also include multiple card stack drivers that are placed at angles with respect to each other to maximize audio fidelity.
Loudspeaker with array of electrostatic card stack drivers
Dipole audio speakers, and more particularly, voice controlled dipole audio speakers having at least one microphone located substantially along the null sound plane of the dipole audio speaker. An improved loudspeaker system that produces an improved audio quality for stereophonic sound. The improved loudspeaker utilizes conventional electro-dynamic drivers in a sealed chamber that produce sound primarily in the 20-300 Hz band coupled with electrostatic card stack drivers placed outside the sealed chamber that cover the remaining 98% of the audio frequency spectrum (300 Hz to 20 kHz). The improved loudspeaker system can also include multiple card stack drivers that are placed at angles with respect to each other to maximize audio fidelity.
Apparatuses and methods for superposition based wave synthesis
The invention provides apparatus and methods for interference based wave synthesis. The invention comprises (i) receiving information defining output wave characteristics, said output wave characteristics comprising at least an output wave frequency B, and an output signal amplitude M, (ii) determining a constant value A and (iii) driving a first input wave generator to generate a first input wave and (iv) driving a second input wave generator to generate a second input wave, such that the interfered wave synthesized by interference of the first input wave and the second input wave has output wave characteristics defined by the received information.
Apparatuses and methods for superposition based wave synthesis
The invention provides apparatus and methods for interference based wave synthesis. The invention comprises (i) receiving information defining output wave characteristics, said output wave characteristics comprising at least an output wave frequency B, and an output signal amplitude M, (ii) determining a constant value A and (iii) driving a first input wave generator to generate a first input wave and (iv) driving a second input wave generator to generate a second input wave, such that the interfered wave synthesized by interference of the first input wave and the second input wave has output wave characteristics defined by the received information.
Acoustic transducer including a modified membrane
This disclosure provides systems, methods, and apparatus related to acoustic transducers.