A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

An electroacoustic transducer assembly includes an electrostatic diaphragm having a surface. The diaphragm includes a film of flexible insulating material and electrically conductive material within the film to achieve a uniform electrical resistivity over the surface.

An electroacoustic transducer assembly includes an electrostatic diaphragm having a surface. The diaphragm includes a film of flexible insulating material and electrically conductive material within the film to achieve a uniform electrical resistivity over the surface.

An MEMS having a layered structure includes a cavity disposed in the layered structure and fluidically coupled to an external environment of the layered structure through at least one opening in the layered structure. The MEMS includes an interaction structure movably disposed in a first MEMS plane and in the cavity along a plane direction and configured to interact with a fluid in the cavity, wherein movement of the interaction structure is causally related to movement of the fluid through the at least one opening. The MEMS further includes an active structure disposed in a second MEMS perpendicular to the plane direction, the active structure mechanically coupled to the insulation structure and configured such that an electrical signal at an electrical contact of the active structure is causally related to a deformation of the active structure, wherein the deformation of the active structure is causally related to movement of the fluid.

An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the transducer, and a high voltage power supply electrically coupled to the high voltage amplifier. At least one of the ear cup assemblies further comprises a power source for providing electric power to the high voltage power supply included in the at least one ear cup assembly. In some cases, one or more of the ear cup assemblies further comprises a wireless communication module for receiving audio signals from an audio source.

An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the transducer, and a high voltage power supply electrically coupled to the high voltage amplifier. At least one of the ear cup assemblies further comprises a power source for providing electric power to the high voltage power supply included in the at least one ear cup assembly. In some cases, one or more of the ear cup assemblies further comprises a wireless communication module for receiving audio signals from an audio source.

An internal failure detection method of an external failure detection system for industrial equipment, the external failure detection system including an array of transducers, the method including: (a) receiving a plurality of signals, each signal being measured by a corresponding transducer of the transducers array; (b) for each pair of transducers among a number of pairs of transducers, calculating at least one value of a correlation parameter between the pair of signals received at step (a) at the pair of transducers, by correlating at least part of the signals or of invertible transforms thereof; (c) for at least one transducer among the number of pairs of transducers, estimating from the values of the correlation parameters calculated at step (b) if the transducer is working properly.

An internal failure detection method of an external failure detection system for industrial equipment, the external failure detection system including an array of transducers, the method including: (a) receiving a plurality of signals, each signal being measured by a corresponding transducer of the transducers array; (b) for each pair of transducers among a number of pairs of transducers, calculating at least one value of a correlation parameter between the pair of signals received at step (a) at the pair of transducers, by correlating at least part of the signals or of invertible transforms thereof; (c) for at least one transducer among the number of pairs of transducers, estimating from the values of the correlation parameters calculated at step (b) if the transducer is working properly.

A micro electro-mechanical film speaker device is provided. A signal input terminal of a signal amplifier circuit is connected to an external input circuit. A second output terminal of the signal amplifier circuit is connected to a negative terminal of a micro electro-mechanical film speaker. A first terminal of a first high-pass filter is connected to a first output terminal of the signal amplifier circuit. A second terminal of the first high-pass filter is connected to a positive terminal of the micro electro-mechanical film speaker. A first terminal of a second high-pass filter is connected to a feedback terminal of the signal amplifier circuit. A second terminal of the second high-pass filter is connected to the positive terminal of the micro electro-mechanical film speaker.

A micro electro-mechanical film speaker device is provided. A signal input terminal of a signal amplifier circuit is connected to an external input circuit. A second output terminal of the signal amplifier circuit is connected to a negative terminal of a micro electro-mechanical film speaker. A first terminal of a first high-pass filter is connected to a first output terminal of the signal amplifier circuit. A second terminal of the first high-pass filter is connected to a positive terminal of the micro electro-mechanical film speaker. A first terminal of a second high-pass filter is connected to a feedback terminal of the signal amplifier circuit. A second terminal of the second high-pass filter is connected to the positive terminal of the micro electro-mechanical film speaker.