H04R19/04

MICROPHONE UNIT
20220415330 · 2022-12-29 ·

A microphone unit includes: an audio data acquisition unit that acquires speech as audio data; an audio data registration unit that registers verification audio data obtained by extracting a feature point from the audio data; an evaluation audio data acquisition unit that acquires speech that is input to a first microphone as evaluation audio data; a verification unit that verifies whether or not a speaker who uttered speech that is based on the evaluation audio data is a speaker who uttered speech that is based on the verification audio data, based on the verification audio data and a feature point extracted from the evaluation audio data; and a verification result output unit that outputs a result of verification performed by the verification unit.

DIFFERENTIAL MEMS-READOUT CIRCUIT AND A METHOD OF USING THE SAME

A differential MEMS-readout circuit comprises a first input bonding pad, including a first contact pin and a second contact pin. The differential MEMS-readout circuit comprises a second input bonding pad, including a first contact pin and a second contact pin; and a differential-readout amplifier section comprising a first input connected to the first contact pin of the first input bonding pad and a second input connected to the first contact pin of the second bonding pad, wherein the differential-readout amplifier section comprises a first and a second transistor circuit and each of the second contact pins of the first and second input bonding pads is coupled to one of the first and the second transistor circuits or is coupled to one of the first and the second transistor circuits and/or to ground.

DIFFERENTIAL MEMS-READOUT CIRCUIT AND A METHOD OF USING THE SAME

A differential MEMS-readout circuit comprises a first input bonding pad, including a first contact pin and a second contact pin. The differential MEMS-readout circuit comprises a second input bonding pad, including a first contact pin and a second contact pin; and a differential-readout amplifier section comprising a first input connected to the first contact pin of the first input bonding pad and a second input connected to the first contact pin of the second bonding pad, wherein the differential-readout amplifier section comprises a first and a second transistor circuit and each of the second contact pins of the first and second input bonding pads is coupled to one of the first and the second transistor circuits or is coupled to one of the first and the second transistor circuits and/or to ground.

MEMS Acoustic Sensor
20220417671 · 2022-12-29 ·

One of the main objects of the present invention is to provide a MEMS acoustic sensor with improved acoustic performance and liability. To achieve the above-mentioned objects, the present invention provides a MEMS acoustic sensor, including: a base with a cavity; a number of structural layers fixed on the base, each including a fixed end fixed to the base and a suspension end extending from the fixed end for being suspended above the cavity, the suspension end being spaced from the base for forming a slit; a piezoelectric functional layer on the suspension end; and a flexible connector completely covering the slit; wherein a Young's modulus of the flexible connector is smaller than a Young's modulus of the structural layer.

MEMS Acoustic Sensor
20220417671 · 2022-12-29 ·

One of the main objects of the present invention is to provide a MEMS acoustic sensor with improved acoustic performance and liability. To achieve the above-mentioned objects, the present invention provides a MEMS acoustic sensor, including: a base with a cavity; a number of structural layers fixed on the base, each including a fixed end fixed to the base and a suspension end extending from the fixed end for being suspended above the cavity, the suspension end being spaced from the base for forming a slit; a piezoelectric functional layer on the suspension end; and a flexible connector completely covering the slit; wherein a Young's modulus of the flexible connector is smaller than a Young's modulus of the structural layer.

WEARABLE STETHOSCOPE AND ITS RELATED MONITORING SYSTEM
20220409130 · 2022-12-29 ·

A wearable stethoscope includes a sound sensing device for collecting heart sound signals of the body, an electrocardiogram sensing device for collecting electrocardiogram signals of the body, a processing unit, powered by a power source, coupled to the sound sensing device and the electrocardiogram sensing device to perform data preprocessing on the above-mentioned signals to remove background noise. An external electronic computing device is set up to analyze and process the fed pre-processed ECG signal and heart sound signal, perform feature extraction in combination with the user's physiological parameters and medical records to obtain related feature vectors, input the feature vectors into a screening model, obtain an evaluation value and give corresponding suggestions. After screening, users can upload the verification results to the cloud database to expand the existing training samples for further optimizing the parameters of the screening model.

WEARABLE STETHOSCOPE AND ITS RELATED MONITORING SYSTEM
20220409130 · 2022-12-29 ·

A wearable stethoscope includes a sound sensing device for collecting heart sound signals of the body, an electrocardiogram sensing device for collecting electrocardiogram signals of the body, a processing unit, powered by a power source, coupled to the sound sensing device and the electrocardiogram sensing device to perform data preprocessing on the above-mentioned signals to remove background noise. An external electronic computing device is set up to analyze and process the fed pre-processed ECG signal and heart sound signal, perform feature extraction in combination with the user's physiological parameters and medical records to obtain related feature vectors, input the feature vectors into a screening model, obtain an evaluation value and give corresponding suggestions. After screening, users can upload the verification results to the cloud database to expand the existing training samples for further optimizing the parameters of the screening model.

Backplate for Recording Microphone, and Recording Microphone
20220417667 · 2022-12-29 ·

The present application relates to a backplate for a recording microphone, and the recording microphone, belonging to the technical field of acoustoelectric conversion. A surface, facing a diaphragm, of the backplate is a spherical surface recessed away from the diaphragm. According to the backplate for the recording microphone and the recording microphone provided by the present application, the maximum sound pressure level that the recording microphone can withstand is effectively increased, and the occurrence of attachment between the diaphragm and the backplate under the action of high-sound-pressure-level signals is reduced.

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
20220417632 · 2022-12-29 ·

A MEMS microphone includes a substrate having a cavity, a diaphragm disposed above the substrate to correspond to the cavity, and a back plate disposed above the diaphragm. The diaphragm includes a concave-convex structure, and the back plate includes a second concave-convex structure corresponding to the concave-convex structure.

VIBRATION SENSING ASSEMBLY

A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.