Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.

Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.

A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

Disclosed are a MEMS chip and an electronic device. The chip can include a substrate having a back cavity, as well as a back electrode and an induction membrane both disposed on the substrate, wherein the back electrode and the induction membrane are located on the back cavity and constitute a capacitor structure, the induction membrane comprises an active area opposite to the back cavity, an inactive area disposed outside the active area, and an isolation area located between the active area and the inactive area, and the isolation area comprises two insulation loops connected to the active area and the inactive area respectively, and a buffer area connected between the two insulation loops, both of the insulation loops being disposed around the active area.

A microphone with an additional piezoelectric component for energy harvesting is provided, and includes a substrate penetrated through by a cavity, a diaphragm, and a piezoelectric conversion. The diaphragm includes a vibration portion and at least one connecting arm, and two ends of each of the at least one connecting arm are connected to the vibration portion and the substrate, respectively. The piezoelectric conversion component is disposed on one of the at least one connecting arm and configured to convert mechanical energy collected from a displacement of the diaphragm by sound to electrical energy. The piezoelectric conversion component is mounted on the diaphragm, so as to convert the mechanical energy collected from the diaphragm by the sound to the electrical energy, thereby effectively recycling the mechanical energy and avoiding a waste of energy.

A comb-like capacitive microphone includes a substrate penetrated by a cavity having an upper part provided with a step, stationary electrodes equally spaced on the step, and a diaphragm received in the step and including a vibrating portion and a connecting portion connected to the vibrating portion. Movable electrodes protrude from a periphery of the vibrating portion, and an end of the connecting portion away from the vibrating portion is connected to the substrate. The stationary electrodes are arranged in a comb shape and directly etched on the substrate, and the movable electrodes are arranged in a comb shape. The stationary electrodes are spatially separated from the movable electrodes, each stationary electrode is corresponding to each movable electrode. Such structure of the comb-like capacitive microphone offers a relatively large displacement, to decrease the acoustic noise and to offer a high sensitivity, and eventually a sound transducer with high performances.

Embodiments include a microphone array with a plurality of microphone elements comprising a first set of elements arranged along a first axis, comprising at least two microphone elements spaced apart by a first distance; a second set of elements arranged along the first axis, comprising at least two microphone elements spaced apart by a second, greater distance, such that the first set is nested within the second set; a third set of elements arranged along a second axis orthogonal to the first axis, comprising at least two microphone elements spaced apart by the second distance; and a fourth set of elements nested within the third set along the second axis, comprising at least two microphone elements spaced apart by the first distance, wherein each set includes a first cluster of microphone elements and a second cluster of microphone elements spaced apart by the specified distance.

Embodiments include a microphone array with a plurality of microphone elements comprising a first set of elements arranged along a first axis, comprising at least two microphone elements spaced apart by a first distance; a second set of elements arranged along the first axis, comprising at least two microphone elements spaced apart by a second, greater distance, such that the first set is nested within the second set; a third set of elements arranged along a second axis orthogonal to the first axis, comprising at least two microphone elements spaced apart by the second distance; and a fourth set of elements nested within the third set along the second axis, comprising at least two microphone elements spaced apart by the first distance, wherein each set includes a first cluster of microphone elements and a second cluster of microphone elements spaced apart by the specified distance.

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.