A transducer system has a transducer configured to receive an incident signal and produce an output signal as a function of the incident signal. As known in the art, the output signal has a −3 dB point. The transducer system also has circuitry operatively coupled with the transducer. The circuitry includes an amplifier with an output configured to produce an amplified signal as a function of the output signal. In addition, the circuitry further has a positive feedback loop and a negative feedback loop that both are electrically coupled between the transducer and the amplifier. The positive feedback loop is configured to move the −3 dB point in a first frequency direction. Conversely, the negative feedback loop is configured to move the −3 dB point in a second frequency direction. Preferably, the first and second frequency directions are different.

A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber, the hollow chamber communicating with the opening of the plurality of acoustic holes away from the cavity, completing the MEMS microphone.

A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber, the hollow chamber communicating with the opening of the plurality of acoustic holes away from the cavity, completing the MEMS microphone.

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

A sensor arrangement is provided, including a first capacitive sensor and a second capacitive sensor. A charge pump is coupled to the first capacitive sensor and to the second capacitive sensor, the charge pump being operable to deliver a positive bias voltage. A differential output has a first terminal coupled to the first capacitive sensor and a second terminal coupled to the second capacitive sensor.

A sensor arrangement is provided, including a first capacitive sensor and a second capacitive sensor. A charge pump is coupled to the first capacitive sensor and to the second capacitive sensor, the charge pump being operable to deliver a positive bias voltage. A differential output has a first terminal coupled to the first capacitive sensor and a second terminal coupled to the second capacitive sensor.

A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.

A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.

A capacitive microphone includes a substrate, a plurality of stationary electrodes, a diaphragm, and a backplate. The substrate includes a cavity and a step disposed in the cavity, and the plurality of stationary electrodes is equally spaced on the step. A diaphragm is received in the step and includes a vibration portion and a connecting portion connected to the vibration portion. A plurality of movable electrodes protrudes from a periphery of the vibration portion, and one end of the connecting portion away from the vibration portion is connected to the substrate. The backplate is provided with a plurality of sound transmission holes, and a gap is formed between the backplate and the diaphragm to form electrode plates of a variable capacitor. The capacitive microphone can get a higher signal-to-noise ratio, improve the capability of suppressing linear distortion, and improve the anti-interference capability of the microphone.