One of the main objects of the present invention is to provide a vibration sensor with improved sensitivity. To achieve the above-mentioned object, the present invention provides a vibration sensor including a circuit board assembly; a housing fixed to the circuit board assembly for forming an accommodation space cooperatively with the circuit board assembly; and a diaphragm assembly accommodated in the accommodation space and secured to the circuit board assembly. The diaphragm assembly includes a gasket fixed to the circuit board assembly, and a first diaphragm fixed to a side of the gasket away from the circuit board assembly. The sensor further includes a vibration cavity enclosed by the gasket, the first diaphragm, and the circuit board assembly, and a MEMS microphone accommodated in the vibration cavity and electrically connected to the circuit board assembly.

One of the main objects of the present invention is to provide a vibration sensor with improved sensitivity. To achieve the above-mentioned object, the present invention provides a vibration sensor including a circuit board assembly; a housing fixed to the circuit board assembly for forming an accommodation space cooperatively with the circuit board assembly; and a diaphragm assembly accommodated in the accommodation space and secured to the circuit board assembly. The diaphragm assembly includes a gasket fixed to the circuit board assembly, and a first diaphragm fixed to a side of the gasket away from the circuit board assembly. The sensor further includes a vibration cavity enclosed by the gasket, the first diaphragm, and the circuit board assembly, and a MEMS microphone accommodated in the vibration cavity and electrically connected to the circuit board assembly.

A circuit includes a first biasing voltage source, a second biasing voltage source, a first resistor device coupled between the first biasing voltage source and a first terminal of the circuit, a second resistor device coupled between the second biasing voltage source and a second terminal of the circuit, a third resistor device coupled between the second biasing voltage source and a third terminal, a first capacitor coupled between the third terminal and ground, and an amplifier having an input coupled to the second terminal and an output coupled to a circuit output.

Improving motion sensor robustness utilizing a room-temperature-volcanizing (RTV) material via a solder resist dam is presented herein. A sensor package comprises: a first semiconductor die; a second semiconductor die that is attached to the first semiconductor die to form a monolithic die; and a substrate comprising a top portion and a bottom portion, in which the top portion comprises a plurality of solder resist dams, the monolithic die is attached to the top portion of the substrate via the RTV material being disposed in a defined area of the top portion of the substrate, and the bottom portion of the substrate comprises electrical terminals that facilitate attachment and electrical coupling of signals of the sensor package to a printed circuit board.

A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.

A signal processing method and device of a MEMS microphone and a MEMS microphone are disclosed. The method comprises: acquiring a first electrical signal obtained by converting a received optical signal by an optical sensor disposed near a sound hole of the MEMS microphone; acquiring a second electrical signal output by the MEMS microphone; and judging that the second electrical signal is an interference signal when within a substantially overlapping time range, the first electrical signal acquired reaches a preset first threshold value and the second electrical signal acquired meets a preset condition.

An acoustic transducer comprises a transducer substrate, and an aperture having a non-circular perimetral shape defined through the transducer substrate. A diaphragm is disposed on the transducer substrate and coupled to a surface of the transducer substrate via at least one diaphragm anchor such that a gap is defined between the diaphragm and the transducer substrate, and an outer periphery of the diaphragm extends radially outwards of a rim of the aperture such that a portion of the diaphragm overhangs the aperture.

An acoustic transducer comprises a transducer substrate, and an aperture having a non-circular perimetral shape defined through the transducer substrate. A diaphragm is disposed on the transducer substrate and coupled to a surface of the transducer substrate via at least one diaphragm anchor such that a gap is defined between the diaphragm and the transducer substrate, and an outer periphery of the diaphragm extends radially outwards of a rim of the aperture such that a portion of the diaphragm overhangs the aperture.

Disclosed embodiments provide glitch prediction based on machine learning algorithms in mixed analog and digital systems, particularly directed to digital microelectromechanical (MEMS) multipath acoustic sensors or microphones, which allow seamless, low latency gain changes without audible artifacts or interruptions in the audio output signal.

Disclosed embodiments provide glitch prediction based on machine learning algorithms in mixed analog and digital systems, particularly directed to digital microelectromechanical (MEMS) multipath acoustic sensors or microphones, which allow seamless, low latency gain changes without audible artifacts or interruptions in the audio output signal.