This application relates to methods and apparatus for digital microphones. Disclosed is a digital microphone apparatus (300) for outputting a digital output signal (DATA) at a sample rate defined by a received clock signal (CLK). The apparatus includes a band splitter (302) configured to receive a microphone signal (S.sub.MD) indicative of an output of a microphone transducer and split said microphone signal into first signal path (S.sub.P1) for frequencies in a first band and a second signal path (S.sub.P2) for frequencies in a second band, the frequencies of the second band being higher than the frequencies in the first band. A modulation block (304) is configured to operate on the second signal path to apply a selective gain modulation to signals in the second signal path.

The application relates to integrated MEMS transducers comprising a MEMS transducer structure formed of a plurality of transducer layers and at least one circuit component formed from a plurality of circuitry (CMOS) layers. The integrated MEMS transducer further comprises a conductive enclosure that is integral to the transducer layers and circuitry layers. The at least one circuit component is inside the conductive enclosure whilst the MEMS transducer structure is outside the enclosure.

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

A microphone includes: a first substrate having one or more first penetration holes; a vibrating membrane disposed on the first substrate and covering the first penetration holes; a fixed membrane disposed at a predetermined distance over the vibration membrane and having a plurality of air intake holes; and a phase delay unit bonded by a bonding pad on the fixed membrane, having a plurality of second penetration holes connected to the one or more first penetration holes, and having a phase delay material in the second penetration holes. A method of manufacturing a microphone including a phase delay unit is also disclosed.

A microphone includes: a first substrate having one or more first penetration holes; a vibrating membrane disposed on the first substrate and covering the first penetration holes; a fixed membrane disposed at a predetermined distance over the vibration membrane and having a plurality of air intake holes; and a phase delay unit bonded by a bonding pad on the fixed membrane, having a plurality of second penetration holes connected to the one or more first penetration holes, and having a phase delay material in the second penetration holes. A method of manufacturing a microphone including a phase delay unit is also disclosed.

Disclosed is an acoustic transducer for converting a sound signal into an electric signal, including a mobile element movable under the effect of the sound signal, a fixed element opposite the mobile element, a recess, and a dissipative element between the mobile and fixed elements. The coupled system has a natural frequency corresponding to a resonance frequency of the transducer set at maximum sensitivity. The mobile element, the fixed element, the dissipative element and the recess are configured so the quality factor of the acoustic transducer>2. The recess has a straight prismatic, cylindrical, or frustoconical shape, the mobile element forming a first base of the prism, cylinder, or frustum, the fixed element being inside the prism, cylinder or frustum, over the second base of the prism, cylinder or frustum. Such a transducer also incorporates an analogue filtering function for filtering the signal around the natural frequency of same.

Disclosed is an acoustic transducer for converting a sound signal into an electric signal, including a mobile element movable under the effect of the sound signal, a fixed element opposite the mobile element, a recess, and a dissipative element between the mobile and fixed elements. The coupled system has a natural frequency corresponding to a resonance frequency of the transducer set at maximum sensitivity. The mobile element, the fixed element, the dissipative element and the recess are configured so the quality factor of the acoustic transducer>2. The recess has a straight prismatic, cylindrical, or frustoconical shape, the mobile element forming a first base of the prism, cylinder, or frustum, the fixed element being inside the prism, cylinder or frustum, over the second base of the prism, cylinder or frustum. Such a transducer also incorporates an analogue filtering function for filtering the signal around the natural frequency of same.

Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.

Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.