H04R19/04

Fixed Electrode and Electroacoustic Transducer
20170245061 · 2017-08-24 ·

A fixed electrode configured to face a diaphragm and forming a capacitance with the diaphragm, including a plurality of protrusions formed by plastic deformation on one surface of the fixed electrode that is to face the diaphragm, so as to protrude toward the diaphragm.

HEARING AID SYSTEM AND A METHOD OF OPERATING A HEARING AID SYSTEM
20170245063 · 2017-08-24 · ·

A method (400) of operating a hearing aid system, wherein the sensitivity of an input transducer is reduced in response to a trigger event, whereby clipping due to limited dynamic range of the input transducer can be avoided and wherein the sensitivity of the input transducer is controlled using a digital pulse train whereby a high resolution control is obtained and a hearing aid system adapted to carry out the method.

HEARING AID SYSTEM AND A METHOD OF OPERATING A HEARING AID SYSTEM
20170245062 · 2017-08-24 · ·

A method (300) of operating a hearing aid system (100), wherein the dynamic range of input signal levels is improved by reducing the sensitivity of an input transducer in response to a trigger event while at the same time applying a gain adapted to compensate the reduced sensitivity and a hearing aid system (100, 200) adapted to carry out the method.

LOW-COST MINIATURE MEMS VIBRATION SENSOR
20170240418 · 2017-08-24 ·

A vibrational sensor comprises a microelectromechanical (MEMS) microphone having a base and a lid defining an enclosure, a MEMS acoustic pressure sensor within the enclosure, and a port defining an opening through the enclosure and material that is arranged to plug the port of the MEMS microphone. In embodiments, the MEMS microphone further includes an integrated circuit within the enclosure that is electrically connected to the MEMS acoustic pressure sensor. In some embodiments, the integrated circuit is configured to bias and buffer the MEMS acoustic pressure sensor. In these and other embodiments, the integrated circuit includes circuitry for conditioning and processing electrical signals generated by the MEMS acoustic pressure sensor. In embodiments, the material is arranged with respect to the port so as to cause the MEMS acoustical pressure sensor to sense vibrational energy rather than acoustic energy as in a conventional MEMS microphone.

LOW-COST MINIATURE MEMS VIBRATION SENSOR
20170240418 · 2017-08-24 ·

A vibrational sensor comprises a microelectromechanical (MEMS) microphone having a base and a lid defining an enclosure, a MEMS acoustic pressure sensor within the enclosure, and a port defining an opening through the enclosure and material that is arranged to plug the port of the MEMS microphone. In embodiments, the MEMS microphone further includes an integrated circuit within the enclosure that is electrically connected to the MEMS acoustic pressure sensor. In some embodiments, the integrated circuit is configured to bias and buffer the MEMS acoustic pressure sensor. In these and other embodiments, the integrated circuit includes circuitry for conditioning and processing electrical signals generated by the MEMS acoustic pressure sensor. In embodiments, the material is arranged with respect to the port so as to cause the MEMS acoustical pressure sensor to sense vibrational energy rather than acoustic energy as in a conventional MEMS microphone.

PRESSURE SENSOR, PRESSURE SENSOR SYSTEM, MICROPHONE, BLOOD PRESSURE SENSOR AND TOUCH PANEL

According to one embodiment, a pressure sensor includes a film portion, a sensor unit, and a structure body. The film portion has a front surface and is deformable. The sensor unit includes a plurality of sensing elements arranged along the front surface. One of the plurality of sensing elements includes a magnetic layer, a opposing magnetic layer, and a nonmagnetic intermediate layer. The structure body is arranged with the first sensor unit along the arrangement direction of the plurality of sensing elements. The structure body includes a structure body layer, a opposing structure body layer, and a intermediate structure body layer. The structure body layer has at least one of a floating potential with respect to the opposing structure body layer or same potential as a potential of the opposing structure body layer.

System and method for a programmable voltage source
09743196 · 2017-08-22 · ·

In accordance with an embodiment, a method of operating a charge pump includes providing a first programmable voltage to a plurality of clock generators having outputs coupled to first nodes of corresponding groups of charge pump capacitors, and selecting a second node of one capacitor from one of the corresponding groups of charge pump capacitors. The clock generators produce a plurality of clock signals having amplitudes proportional to the first programmable voltage.

System and method for a programmable voltage source
09743196 · 2017-08-22 · ·

In accordance with an embodiment, a method of operating a charge pump includes providing a first programmable voltage to a plurality of clock generators having outputs coupled to first nodes of corresponding groups of charge pump capacitors, and selecting a second node of one capacitor from one of the corresponding groups of charge pump capacitors. The clock generators produce a plurality of clock signals having amplitudes proportional to the first programmable voltage.

Transducer with enlarged back volume
09738515 · 2017-08-22 · ·

A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

Dual-diaphragm microphone module to reduce vibration noise

A microphone module disposed in an electronic device for reducing echo noise. The microphone module includes a casing, a first diaphragm disposed in the casing, a second diaphragm disposed in the casing and a substrate disposed between the first diaphragm and the second diaphragm and joined to the casing to define a first space and a second space which are isolated and separated from each other. The first diaphragm is disposed in the first space, the second diaphragm is disposed in the second space, and the substrate is electrically connected with the first diaphragm and the second diaphragm.