The present disclosure relates generally to microphones and related components. One example micro electro mechanical system (MEMS) motor includes a first diaphragm; a second diaphragm that is disposed in generally parallel relation to the first diaphragm, the first diaphragm and second diaphragm forming an air gap there between; and a back plate disposed in the air gap between and disposed in generally parallel relation to the first diaphragm and the second diaphragm.

The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a barometric release. The acoustic assembly also includes a second die disposed on the base. The second die comprises a pressure sensor. The acoustic assembly further includes a cover coupled to the base and enclosing the first dies and the second die. A back volume is formed between the base, the first die, the second die, and the cover. The pressure sensor is configured to sense a pressure of the back volume.

The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a barometric release. The acoustic assembly also includes a second die disposed on the base. The second die comprises a pressure sensor. The acoustic assembly further includes a cover coupled to the base and enclosing the first dies and the second die. A back volume is formed between the base, the first die, the second die, and the cover. The pressure sensor is configured to sense a pressure of the back volume.

The disclosure relates to a microphone assembly comprising a multibit analog-to-digital converter configured to receive, sample, and quantize a microphone signal to generate N-bit digital microphone samples representative of the microphone signal at a first sampling frequency. The microphone assembly also comprises a first digital-to-digital converter configured to receive, quantize, and noise-shape the N-bit digital microphone samples to generate a corresponding M-bit Pulse Density Modulated (PDM) signal, wherein N and M are positive integers, and N>M. The microphone assembly may comprise a SoundWire compliant data interface configured to repeatedly receive samples of the M-bit PDM signal and write bits of the M-bit PDM signal to a SoundWire data frame.

The disclosure relates to a microphone assembly comprising a multibit analog-to-digital converter configured to receive, sample, and quantize a microphone signal to generate N-bit digital microphone samples representative of the microphone signal at a first sampling frequency. The microphone assembly also comprises a first digital-to-digital converter configured to receive, quantize, and noise-shape the N-bit digital microphone samples to generate a corresponding M-bit Pulse Density Modulated (PDM) signal, wherein N and M are positive integers, and N>M. The microphone assembly may comprise a SoundWire compliant data interface configured to repeatedly receive samples of the M-bit PDM signal and write bits of the M-bit PDM signal to a SoundWire data frame.

System and method for detecting a glitch is disclosed. An embodiment comprises increasing a bias voltage of a first capacitor, sampling an input signal of a first plate of the first capacitor with a time period, mixing the input signal with the sampled input signal, and comparing the mixed signal with a reference signal.

System and method for detecting a glitch is disclosed. An embodiment comprises increasing a bias voltage of a first capacitor, sampling an input signal of a first plate of the first capacitor with a time period, mixing the input signal with the sampled input signal, and comparing the mixed signal with a reference signal.

A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

A semiconductor device includes a microelectromechanical system (MEMS) die, an encapsulation material, a via element, a non-conductive lid, and a conductive layer. The encapsulation material laterally surrounds the MEMS die. The via element extends through the encapsulation material. The non-conductive lid is over the MEMS die and defines a cavity. The conductive layer is over the MEMS die and the encapsulation material and is electrically coupled to the via element.

A diaphragm of a MEMS microphone is configured to generate a displacement thereof in response to an applied acoustic pressure, and the diaphragm includes a plurality of vent holes having a bent shape to increase the length of the vent holes.