In one embodiment, a MEMS microphone can be coupled to an acoustic horn to provide various benefits and improvements including, but not limited to, at-a-distance acoustic signal reception with improvements in signal-to-noise ratio and directional preference.

In one embodiment, a MEMS microphone can be coupled to an acoustic horn to provide various benefits and improvements including, but not limited to, at-a-distance acoustic signal reception with improvements in signal-to-noise ratio and directional preference.

Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.

Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.

A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.

A microelectromechanical system includes a lower membrane including a plurality of troughs and crests arranged alternately, an upper membrane including a plurality of troughs and crests arranged alternately, and a spacer layer disposed between the lower membrane and the upper membrane. The spacer layer includes counter electrode walls and support walls made of nitride, the counter electrode walls being provided with conductive elements. Chambers are formed between the troughs of the lower membrane and the crest of the upper membrane and the counter electrode walls are suspended in the chambers respectively. The support walls are sandwiched between the crests of the lower membrane and the troughs of the upper membrane with a space formed between adjacent support walls. The spaces between adjacent support walls may be empty or filled with oxide. Unwanted capacitance between the upper and lower membranes is reduced significantly.

A microelectromechanical system includes a lower membrane including a plurality of troughs and crests arranged alternately, an upper membrane including a plurality of troughs and crests arranged alternately, and a spacer layer disposed between the lower membrane and the upper membrane. The spacer layer includes counter electrode walls and support walls made of nitride, the counter electrode walls being provided with conductive elements. Chambers are formed between the troughs of the lower membrane and the crest of the upper membrane and the counter electrode walls are suspended in the chambers respectively. The support walls are sandwiched between the crests of the lower membrane and the troughs of the upper membrane with a space formed between adjacent support walls. The spaces between adjacent support walls may be empty or filled with oxide. Unwanted capacitance between the upper and lower membranes is reduced significantly.

A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

The present disclosure relates generally to microphones and related components. One example micro electro mechanical system (MEMS) motor includes a first diaphragm; a second diaphragm that is disposed in generally parallel relation to the first diaphragm, the first diaphragm and second diaphragm forming an air gap there between; and a back plate disposed in the air gap between and disposed in generally parallel relation to the first diaphragm and the second diaphragm.