H04R19/04

MEMS device with a diaphragm having a slotted layer

An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.

MEMS MICROPHONE WITH MULTIPLE SOUND PORTS
20230254635 · 2023-08-10 ·

An acoustic sensor device comprises a package and a substrate disposed in the package. The acoustic sensor device also comprises a microelectromechanical system (MEMS) transducer formed in the substrate, the MEMS transducer i) comprising a cantilever structure and ii) having a first acoustic impedance and at least two sound ports positioned on the package on opposing sides of the MEMS transducer. The at least two sound ports coupling the MEMS transducer to an ambient environment via respective acoustic channels formed in the package, wherein the at least two sound ports are positioned on the package in a manner that ensures that the respective acoustic channels have a combined second acoustic impendence that is less the first acoustic impedance of the MEMS transducer.

MEMS MICROPHONE WITH MULTIPLE SOUND PORTS
20230254635 · 2023-08-10 ·

An acoustic sensor device comprises a package and a substrate disposed in the package. The acoustic sensor device also comprises a microelectromechanical system (MEMS) transducer formed in the substrate, the MEMS transducer i) comprising a cantilever structure and ii) having a first acoustic impedance and at least two sound ports positioned on the package on opposing sides of the MEMS transducer. The at least two sound ports coupling the MEMS transducer to an ambient environment via respective acoustic channels formed in the package, wherein the at least two sound ports are positioned on the package in a manner that ensures that the respective acoustic channels have a combined second acoustic impendence that is less the first acoustic impedance of the MEMS transducer.

MICRO-ELECTROMECHANICAL TRANSDUCER WITH SUSPENDED MASS

The present invention relates to a micro-electromechanical transducer comprising a pressure detection arrangement and a sub-assembly adapted to cooperate with the pressure detection arrangement via a coupling volume, said sub-assembly comprising one or more moveable masses, a suspension member suspending a number of moveable masses, wherein the coupling volume is at least partly defined by the suspension member, and wherein the coupling volume is acoustically connected to an interior volume of the pressure detection arrangement, and wherein the suspension member comprises a viscoelastic material with a predetermined viscous and sealant behaviour in order to dampen one or more resonance peaks of the micro-electromechanical transducer and acoustically seal the coupling volume. The present invention further relates to a hearing device comprising such a micro-electromechanical transducer.

ADAPTERS FOR MICROPHONES AND COMBINATIONS THEREOF
20220132231 · 2022-04-28 ·

A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

ADAPTERS FOR MICROPHONES AND COMBINATIONS THEREOF
20220132231 · 2022-04-28 ·

A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

ACOUSTIC SENSOR AND ELECTRICAL CIRCUITS THEREFOR
20220132251 · 2022-04-28 ·

An acoustic sensor assembly that produces an electrical signal representative of an acoustic signal, includes an acoustic transduction element disposed in a housing and acoustically, a heat source causing air pressure variations within the housing when energized, and an electrical circuit electrically coupled to the acoustic transduction element and to contacts on an external-device interface of the housing, wherein the electrical circuit is configured to energize the heat source and determine a non-acoustic condition or change therein based on an amplitude of air pressure variations detected by the acoustic transduction element.

ACOUSTIC SENSOR AND ELECTRICAL CIRCUITS THEREFOR
20220132251 · 2022-04-28 ·

An acoustic sensor assembly that produces an electrical signal representative of an acoustic signal, includes an acoustic transduction element disposed in a housing and acoustically, a heat source causing air pressure variations within the housing when energized, and an electrical circuit electrically coupled to the acoustic transduction element and to contacts on an external-device interface of the housing, wherein the electrical circuit is configured to energize the heat source and determine a non-acoustic condition or change therein based on an amplitude of air pressure variations detected by the acoustic transduction element.

Systems and methods for audio capture

A method for noise filtering including receiving directional data corresponding to the relative directions of at least one noise source and at least one target audio source; capturing noise data from the at least one noise source; capturing target audio data from the at least one target audio source; using the directional data to filter the noise data from the target audio data; and outputting filtered target audio.

Systems and methods for audio capture

A method for noise filtering including receiving directional data corresponding to the relative directions of at least one noise source and at least one target audio source; capturing noise data from the at least one noise source; capturing target audio data from the at least one target audio source; using the directional data to filter the noise data from the target audio data; and outputting filtered target audio.