A process for manufacturing a diaphragm unit of a MEMS transducer that includes multiple piezoelectric transducer units, each of the multiple piezoelectric transducer units including at least one electrode layer and at least one piezoelectric layer formed on a carrier includes the step of removing the transducer units from the carrier. At least one of the transducer units that has been removed from the carrier is arranged on a diaphragm and connected to the diaphragm. Moreover, a diaphragm unit made according to the process includes a diaphragm and multiple piezoelectric transducer units arranged on and connected to the diaphragm. Each of the multiple piezoelectric transducer units includes at least one electrode layer and at least one piezoelectric layer formed on a carrier.

A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

This application relate to the field of electronic device technologies, and in particular, to a loudspeaker and an electronic device. Embodiments of this application are provided to resolve a technical problem of insufficient sensitivity of a loudspeaker caused by a small electromagnetic driving force that drives a voice coil to vibrate. According to a loudspeaker and an electronic device in embodiments of this application, a yoke includes a bottom part and a sleeve located on the side of the bottom part. An annular magnet is sleeved on the outer side of the sleeve. A voice coil is sleeved on the sleeve and located between the magnet and the sleeve. A damper is located in a region enclosed by the sleeve. An outer edge of the damper is connected to the voice coil, and a middle part of the damper is connected to the yoke.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.

Presented herein are contaminant-proof microphone assemblies for use with devices/apparatuses, such as auditory prostheses, that include one or more microphones disposed within a housing. A contaminant-proof microphone assembly in accordance with certain embodiments presented herein includes a microphone, a microphone plug, and a contaminant-proof membrane. The microphone plug has a first end coupled to the microphone and a second end that is configured to be positioned adjacent the contaminant-proof membrane. As such, the microphone plug is disposed between a sound inlet of the microphone and the contaminant-proof membrane. The microphone plug may be configured to mate with the housing or a gasket attached to the housing.

A vibration apparatus may include a vibration plate, a vibration generator at the vibration plate, and a connection member between the vibration plate and the vibration generator. The vibration generator may include a vibration structure. The connection member may include a first connection member between the vibration plate and the vibration structure and overlapping the vibration structure. The connection member may also include a second connection member surrounding the first connection member. A modulus of the first connection member may be greater than a modulus of the second connection member.

An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.