A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.

A vibration apparatus can include a first cover member; a second cover member; a vibration portion between the first cover member and the second cover member; a contact portion between the first cover member and the vibration portion; and a signal cable. The signal cable can include a first signal line connected to a first surface of the vibration portion via the contact portion, and a second signal line connected to a second surface of the vibration portion opposite to the first surface of the vibration portion.

A voice-controlled electronic device that includes a device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include one or more microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the one or more microphones and first transducer and second transducers configured to generate sound waves within different frequency ranges.

A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.

A micro-speaker includes a frame body, a diaphragm on the frame body, a magnetic structure and a voice coil in the frame body. An upper end of the voice coil is fixed to the diaphragm. The magnetic structure is arranged under the voice coil. A voice coil balancing system is provided in the frame body, which is composed of two symmetrically arranged dampers, which are respectively arranged under two ends of a long axis of the voice coil and fixed with glue. Each of the dampers is made of a flexible circuit board, including a first end, a second end and a cantilever connecting the first end and the second end. A ratio of a length L of the cantilever to a distribution distance D of the cantilever is between 2-15.

The present disclosure provides a loudspeaker module and an electronic device. The loudspeaker module comprises a module housing and a loudspeaker unit, wherein the module housing has a cavity and the loudspeaker unit is accommodated in the cavity, the loudspeaker unit divides the cavity into a front acoustic cavity and a rear acoustic cavity; wherein a sound outlet hole is provided on the module housing, the front acoustic cavity is communicated with the sound outlet hole by a sound outlet channel; wherein a concave-convex structure is provided separately in a region of the module housing corresponding to the sound outlet channel. According to the present disclosure, resonance of the module housing can be effectively suppressed, to achieve the effects of increasing high-frequency sensitivity of the loudspeaker module and reducing distortion.

A method of making an acoustic sensor (e.g., a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone) includes forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip (e.g., unsupported free end), the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion. The method also comprises attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam. One or more electrodes are disposed on or in the proximal portion of the beam.

Disclosed in embodiments of the present disclosure are a diaphragm assembly, a loudspeaker module and an electronic device, the diaphragm assembly including a diaphragm body and an intermediate patch plate, wherein the diaphragm body includes a first diaphragm body and a second diaphragm body; the first diaphragm body is provided with a first hole; the intermediate patch plate includes a first intermediate patch plate; the second diaphragm body at least partially cover the first hole; the first intermediate patch plate is respectively connected to the first diaphragm body and the second diaphragm body; the first intermediate patch plate is configured to have an enclosed structure, or the intermediate patch plate includes a second intermediate patch plate connected to the second diaphragm body, such that the mid-high frequency curves of the loudspeaker module are smoother, thereby effectively improving the mid-high frequency tone quality.

A tool for arranging voice coil leadouts in a microspeaker comprises an expanding collet constructed and arranged for positioning at an interior of a bobbin having an inner diameter, the expanding collet including a hole that extends through an interior in a longitudinal direction of the expanding collet; a center pin extending through the hole of the expanding collet, the expanding collet applying a force against the inner diameter of the bobbin in response to a position of the center pin in the hole of the expanding collet relative to the interior of the expanding collet; and a forming mandrel including a hole that extends through an interior in a longitudinal direction of the forming mandrel. The expanding collet extends through the hole in, and coaxial with, the forming mandrel. The expanding collet rotates the bobbin about the longitudinal direction of the expanding collet relative to the forming mandrel to form helical leadout regions of a voice coil about the bobbin.

A loudspeaker (1) comprising a diaphragm (2), a voice coil (10) mounted on the diaphragm (2) to move with the diaphragm (2), a chassis (4), and a spider (20) is disclosed. The spider (20) extends across a gap between the chassis (4) and the voice coil (10) and comprises a plurality of legs (36), each leg (36) extending radially across at least a portion of the gap. The diaphragm (2) is configured to move from a neutral position to an extended position. When the diaphragm (2) is in the neutral position the cross-sectional shape of each leg (36) follows a line which varies in height with respect to a reference plane, said line comprising first, second and third curves, the second curve being located in between the first and third curves. Either the first and third curves are convex and the second curve is concave, or the first and third curves are concave and the second curve is convex. Thus, the spider (20) may have legs (36) having an ‘m’ or ‘w’ shaped profile in at least one region of the leg (36).