The present invention provides a MEMS microphone including a substrate with a back cavity and a capacitive system disposed on the substrate. The capacitive system includes a back plate and a vibration diaphragm arranged opposite to the back plate. The back plate includes a middle part and a fixed part surrounding the middle part and fixed to the substrate. The fixed part is arranged with a thickness greater than that of the middle part, and the fixed part includes a first surface away from the substrate and a second surface opposite to the first surface. The first surface includes a first arc connected to the middle part, and the first arc protrudes away from the substrate. Compared with related technologies, the MEMS microphone provided by the present invention can improve the reliability of the back plate.

The present invention provides a MEMS speaker including a substrate sidewall enclosing a cavity. The substrate sidewall includes a first surface and a second surface, a sounding assembly that is arranged on the first surface of the substrate sidewall and also seals the cavity at the opening of the first surface, and a bracket disposed in the cavity. The sounding assembly includes a first sounding assembly and the second sounding assembly. Each sounding assembly includes a driving part and a flexible diaphragm. The flexible diaphragm closes the gap formed between the free ends of adjacent driving parts and between the free ends of the driving parts and the substrate sidewall. The present invention also provides a manufacturing method of MEMS speaker. The MEMS speakers provided by the present invention have high-quality acoustic performance.

A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.

Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

Disclosed are a MEMS microphone structure and a manufacturing method thereof. More particularly, a MEMS microphone structure and a manufacturing method thereof are disclosed, including a plurality of diaphragms and a plurality of back plates configured alternately in a vertical direction so that the areas of the diaphragms and the back plates are maximized within a limited area, thereby improving overall sensitivity.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

The present disclosure provides a microspeaker enclosure including a block formed of a porous material. The microspeaker enclosure includes a microspeaker, an enclosure case in which the microspeaker is mounted, the enclosure case including a back volume communicating with the microspeaker, and a porous block installed in the back volume and prepared by mixing first porous particles having excellent adsorption capacity of nitrogen or oxygen and second porous particles having a porosity of 50% or more.

A read circuit for capacitive sensors such as a MEMS microphones includes a sensor node configured to be coupled to a capacitive sensor to apply a bias voltage to the sensor and sense the capacitance value of the sensor wherein the voltage at the sensor node is indicative of the capacitance value of the capacitive sensor. A switch is provided between the sensor node and the intermediate node. A shock detector coupled to the sensor node and the switch asserts a shock signal to make the switch conductive in response to a shock applied to the capacitive sensor, and de-asserts the shock signal to make the switch non-conductive with a delay after the end of the shock applied to the capacitive sensor.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.