Patent classifications
H04R2201/02
Packaging for a MEMS transducer
The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
Opposing loudspeaker arrangement
A loudspeaker arrangement having a first loudspeaker comprising a first sound radiating surface and a first loudspeaker basket, and a second loudspeaker comprising a second sound radiating surface and a second loudspeaker basket. The first loudspeaker and the second loudspeaker are arranged opposite each other in a first direction, a cavity is formed between a front side of the first loudspeaker and a front side of the second loudspeaker, and the first loudspeaker basket is directly coupled to the second loudspeaker basket.
Microphone bed
A microphone bed for receiving a microphone. The microphone bed including a first compressible portion and first and second non-compressible portions. The first compressible portion is formed to accommodate a first end of the microphone. The first non-compressible portion has the compressible portion coupled thereto, the non-compressible portion having a length that is over half a length of the microphone. The second non-compressible portion is coupled to the first non-compressible portion, which together form a cavity therebetween, the second non-compressible portion having a floor. There is a weighted feature extending upward from the floor of the second non-compressible portion.
Electronic device with multiple modes of attachment
An electronic device with multiple modes of attachment is disclosed herein. In one or more embodiments, the electronic device includes a device assembly having a housing; a clip member coupled to the housing; a first magneto coupler coupled to the housing; and a removable member having a second magneto coupler. The second magneto coupler of the removable member is capable of being magnetically coupled to the first magneto coupler that is coupled to the housing, so the magnetic coupling allows the housing to be attached to a non-edge portion of a non-metallic and/or non-magnetic item when the item is placed between the first magneto coupler and the removable member. The clip member allows the housing to be attached to, and detached from, an edge of a non-metallic and/or non-magnetic item when the removable member is magnetically coupled to the housing, and there is no item between the first magneto coupler and removable member.
Conical electrostatic speaker
An electrostatic speaker driver having specially configured stators and diaphragm for multi-directional sound projection is described. The stators and diaphragm may be frustoconical for example. Stators may have apertures to enable sound generated by vibration of the diaphragm to project in desired directions. The speaker drivers may stand alone, or alternatively, may be part of a speaker assembly including one or more speaker drivers.
MICROPHONE PACKAGE FOR EPOXY OVERFLOW PROTECTION GUARD RING IN CAVITY PCB
A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.
Electronic component module, combination of electronic component module and casing, and control device including the combination
An electronic component module including a fixing part, a function part housed in, or fixed to, the fixing part, at least one connection line, and at least one protrusion on the function part or the fixing part. The fixing part includes an abutting face, an outer face extending from an end of the abutting face in a direction including a component of a first direction, and an edge line along which the abutting and outer faces meet. The connection line is flexible, electrically connected to the function part, positioned on a second direction side relative to the abutting face, and configured to be led out in a third direction from an inside to an outside relative to the edge line. The protrusion extends at least partly in the third direction and is positioned at least partly on the first direction side relative to the connection line in the led-out state.
Method for removing dust using speaker and electronic device supporting the same
An electronic device includes a housing surrounding an exterior of the electronic device and including at least one opening, a sensor module including at least one sensor, a sound output device including sound output circuitry configured to output an acoustic-signal through the at least one opening, a memory, and a processor electrically connected to the sensor module and the sound output device, wherein the processor may be configured to: determine whether the electronic device is in a state where a foreign substance has entered into the electronic device through the at least one opening, determine whether the electronic device is in a first disposition state using the sensor module based at least on determining that the electronic device is in the state where the foreign substance has entered into the electronic device, and control the electronic device to output a specified acoustic-signal having a specified frequency band and a specified waveform through the sound output device based on the electronic device being in the first disposition state.
Head Covering Device with Communication Hardware
A head covering device comprising a rigid component comprising a transparent face shield, a fabric component, wherein the face shield and fabric combine to cover an entire head of a user and form a seal around the user's neck, an intake port with an inlet filter, an exhaust port with an exhaust filter, an air mover causing filtered air to enter the intake port and exhaust air to exit the exhaust port, and communication hardware facilitating communication for the user.
DIRECTIONAL SOUND CAPTURE USING IMAGE-BASED OBJECT TRACKING
A method for directional sound capture. The method includes capturing, using a camera device, a sequence of images of a scene comprising a light source attached to a sound source object, detecting, by a hardware processor based on a pattern of local light change across the sequence of images, the light source in the scene, determining a direction of the sound source object by at least determining a location of the light source in at least one image of the sequence of images, transmitting, to a direction control device coupled to a microphone, a control signal to direct a sensitivity direction of the microphone towards the sound source object, and capturing, using the microphone and in response to directing the sensitivity direction of the microphone towards the sound source object, the sound emitted from the sound source object.