A micrometric speaker includes a frame, an electromechanical transducer, and a mechanical-acoustic transducer comprising a rigid plate movably mounted in the frame. The electromechanical transducer comprises two piezoelectric actuators and two elastic strips. The frame comprises a central crossmember from which the two strips extend until engaging two lateral coupling edges of the mechanical-acoustic transducer, and the mechanical-acoustic transducer comprises two linearising springs each extending from one of the lateral edges to the rigid plate, to enable, during a deformation of the strips, a movement of the two lateral edges to the central crossmember and reduce the longitudinal constraints applied to the strips during their deformation due to their “recessed-guided” bending configuration.

The present invention discloses a loudspeaker, and a manufacturing method and a sound production method therefor. The loudspeaker includes a vibrating diaphragm, a frame, a magnetic loop system, a voice coil, a suspension edge, a connecting member and a limiting part, wherein the magnetic loop system is arranged on the frame. A lower end of the voice coil is coupled to the magnetic loop system. A suspension edge outer side and a suspension edge inner side of the suspension edge extend and are respectively connected to the frame and the vibrating diaphragm, so as to allow the suspension edge to be maintained between the frame and the vibrating diaphragm. The connecting member is configured to connect to the vibrating diaphragm and the voice coil. A limiting outer side and a limiting inner side of the limiting part extend and are respectively connected to the frame and the connecting member, so as to allow the limiting part to be maintained between the frame and the connecting member.

A hybrid diaphragm structure is provided. The hybrid diaphragm structure includes a substrate, a first diaphragm disposed in a central region of the substrate, a first coil structure disposed over the first diaphragm, a first groove separating the first diaphragm and the first coil structure from the substrate, and a first bridge structure coupling the first diaphragm to the substrate. The first diaphragm and the substrate include a same material.

Aspects of acoustic transducers are described. One aspect is a microelectromechanical (MEMS) transducer comprising a substrate and multiple cantilevered beams. A first cantilevered beam comprises a first protrusion and a first piezoelectric structure, where the first piezoelectric structure comprises a first deflection end and a first fixed end, where the first fixed end is coupled to the substrate, and where the first deflection end is cantilevered away from the substrate. The first cantilevered beam is separated from a second cantilevered beam by a gap. The first protrusion is disposed at the first deflection end and increases a thickness of the first cantilevered beam along the gap at the first deflection end. A second protrusion of the second beam is disposed at a second deflection end and increases a thickness of the second cantilevered beam along the gap at the second deflection end.

A speaker may be configured with at least one diaphragm positioned proximal to and separated from an array of magnets. The diaphragm may consist of a substrate and at least one patterned electrically conductive trace with a portion of the diaphragm knurled to provide a ridge extending a height above the diaphragm that is at least twice a thickness of the diaphragm.

A speaker core, speaker, and associated electronic device include at least one bent portion of a diaphragm folded ring suspended over a top of a diaphragm frame enclosing an enlarged vibration space.

The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

A speaker includes a frame having an accommodation space; a magnetic circuit system accommodated in the accommodation space; and a vibration system accommodated in the accommodation space for generating sound. The vibration system includes a diaphragm and a voice coil. The diaphragm includes a first part fixed with the frame and a second part arranged between the first part and the frame. One end of the second part is connected with the first part. The accommodation space is divided by the second part into a first accommodation space for accommodating the magnetic circuit system and a second accommodation space for accommodating the voice coil.

According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in a first plane, a reflection structure including second reflective elements and configured to deflect with respect to the diffraction structure, and an optical element configured to direct a first optical signal at the diffraction structure and the reflection structure and to receive a second optical signal from the diffraction structure and the reflection structure. The second reflective elements are arranged in the first plane when the reflection structure is at rest. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.

An acoustic diaphragm made at least in part from an expanded material. The expanded material includes one or more of cellulose, synthetic fibers and glass fibers. The expanded material has more than about 55% by volume voids.