A hearing device includes: a carrier board; a multi-chip assembly including a magnetic induction control chip and a signal processor; a magnetic induction coil at the carrier board; a hearing device housing having a first end and a second end, the second end being opposite from the first end; and a battery, wherein the battery is provided closer to the second end of the hearing device housing than to the first end of the hearing device housing; wherein the multi-chip assembly and the magnetic induction coil are accommodated in the hearing device housing, and are between the battery and the first end of the hearing device housing.

The present disclosure provides methods and systems for reducing noise induced in one or more components in a hearing aid. The present disclosure provides methods for reducing noise induced in telecoils.

A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

A hearing aid device having a telecoil and a power consuming element is disclosed. The hearing aid device further comprises an at least partial loop in the power supply line, which at least partial loop provides a magnetic signal that at least attenuates or cancels noise induced from the power draw of the power consuming component.

A hearing aid includes: a first microphone system configured for conversion of sound emitted by a sound source into a first audio signal; a first matched filter configured for filtering the first audio signal into a first filtered audio signal, the first matched filter having a first matching transfer function that substantially matches a first transfer function of a first sound propagation path leading from the sound source to the first microphone system, when a user wears the hearing aid; and a hearing loss processor configured to provide a hearing loss compensated output signal that compensates for a hearing loss of the user based at least in part on the first filtered audio signal.

A hearing device includes: a multi-chip assembly including a plurality of integrated circuit chips, the plurality of integrated circuit chips including one or a combination of a wireless communication chip, a power management chip, and a signal processing chip; wherein the multi-chip assembly comprises: a first layer having a surface, a spacer layer being configured to accommodate one or more of the plurality of integrated circuit chips as one or more embedded chips, and a ground layer below the first layer and the spacer layer, and a first shielding layer between the spacer layer and the first layer.

A method operates a hearing device, in which an adaptation to the hearing device by a hearing device wearer is determined. An ambient situation is detected, and a value is assigned to the ambient situation. The value is used as a degree of adaptation. A hearing device includes a microphone for detecting the ambient situation and a hearing device system includes a hearing device, as well as the use of a hearing device and a computer program product.

A hearing instrument is provided that has a T-coil antenna (14) for picking up an inductively transmitted base-band audio signal, an audio signal processing unit (16) for processing the picked-up T-coil audio signal, an output transducer (18) for stimulation of the user's hearing according to the processed audio signals, and a functional unit (22) that operates in a duty cycling mode and communicates with the audio signal processing unit the respective interference points at which the functional unit is switched from its inactive state to its active state and/or from its active state to its inactive state, wherein the audio signal processing unit applies a click removal treatment to the T-coil audio signal during the respective interference points at the time at which the functional unit is switched to and/or from its active state.

Disclosed is a system, a hearing device and a method for encapsulating one or more electronic components on a substrate. The method comprises providing a dam on the substrate, the dam is provided around the one or more electronic components, the dam comprises a dam material comprising an electrically conducting material. The method comprises providing a liquid fill encapsulation material within the dam on the substrate, the fill encapsulation material encapsulates the one or more electronic components, the fill encapsulation material is configured to solidify, the solidified fill encapsulating material comprises a first surface exposed to surroundings. The method comprises applying a cover material on the first surface of the solidified fill encapsulation material, the cover material comprising an electrically conducting material, whereby the one or more electronic components are encapsulated and electromagnetically shielded.

A device is provided. The device includes an antenna for communicating with one or more hearing aids. The device further comprises a coil for receiving a wireless signal. The device comprises a first ground plane connected to the antenna. The device comprises a second ground plane connected to the coil. The first ground plane and the second ground plane are decoupled via a decoupling element so that noise from one ground plane does not propagate to the other ground plane at certain frequencies.