A MEMS microphone and a method for manufacturing a MEMS microphone are disclosed. Embodiments of the invention provide a MEMS microphone including a MEMS microphone structure having at least one counter electrode structure and a diaphragm structure deflectable with respect to the counter electrode structure and a thermocouple arranged at the MEMS microphone structure.

The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

The invention relates to audio transducers, such as loudspeaker, microphones and the like, and includes improvements in or relating to: audio transducer diaphragm structures and assemblies, audio transducer mounting systems; audio transducer diaphragm suspension systems, personal audio devices incorporating the same and any combination thereof. The embodiments of the invention include linear action and rotational action transducers. For both types of transducer, rigid and composite diaphragm constructions and unsupported diaphragm periphery designs are described. Systems and methods for mounting the transducer to a housing, such as an enclosure or baffle are also described. Furthermore, hinge systems including: rigid contact hinge systems and flexible hinge systems are also disclosed for various rotational action transducer embodiments. Various applications and implementations are described and envisaged for the audio transducer embodiments including, for example, personal audio devices such as headphones, earphones and the like.

A loudspeaker diaphragm (12) comprising a woven fibre body supports damping material (25), for example PVA polymer, on a rearward-facing surface (24). The woven fibre body may be formed of lengths (14) non-metallic fibre material (for example glass fibre) coating with a thin metal coating (32). The mass of the layer of damping material (25) may be less than the mass of the woven fibre body. An attractive sparkly looking loudspeaker diaphragm (12) may thus be provided which damps undesirable vibration whilst providing a flatter frequency-response curve (50).

A display apparatus includes a display module including a display panel configured to display an image, a rear cover on a rear surface of the display module, and a sound generating module at the rear cover and configured to vibrate the display module to generate sound, and a rear surface of the sound generating module is covered by the rear cover.

A speaker device comprising two membranes facing each other, and two drive units arranged for driving the two membranes in opposite direction in operation. A vented frame element and a closed frame element are positioned outward on either side of the two membranes. At least one bellows element is connected on a first side to the membrane which is positioned closest to the closed frame element, and connected on a second side to the closed frame element.

According to an embodiment, a MEMS transducer includes a stator, a rotor spaced apart from the stator, and a multi-electrode structure including electrodes with different polarities. The multi-electrode structure is formed on one of the rotor and the stator and is configured to generate a repulsive electrostatic force between the stator and the rotor. Other embodiments include corresponding systems and apparatus, each configured to perform corresponding embodiment methods.

The present invention provides a diaphragm structure of a sounding apparatus comprising: a thin-film layer; a first circuit thin-film layer fixed on a first side of the thin-film layer by means of a first electrolytic bonding layer; a second circuit thin-film layer fixed on a second side of the thin-film layer by means of a second electrolytic bonding layer; multiple holes passing through the first circuit thin-film layer, the thin-film layer and the second circuit thin-film layer; and multiple conductive layers disposed on inner circumferential walls of the holes and in contact with the first circuit thin-film layer and the second circuit thin-film layer. In the diaphragm structure provided by the present invention, instead of using back adhesives, electrolytic bonding is used to fix the circuit thin-film layers on two sides of a thin-film layer, thereby greatly reducing the thickness of the diaphragm structure.

A film speaker includes a metal foil, a diaphragm apart from and opposed to the metal foil, an elastomer for supporting the diaphragm, and a voice coil disposed on the metal foil for producing magnetic field. The diaphragm includes a polymer magnetic material layer and a metal foil reinforcing layer attached to a surface of the polymer magnetic material layer for interacting with the magnetic field produced by the voice coil so as to drive the diaphragm to vibrate for generating sound.

A dielectric film which has high electrical resistance and excellent durability and a process for producing the dielectric film are provided. Also provided is a transducer which has large displacement and excellent durability. The dielectric film includes a three-dimensional crosslinked body that is synthesized from an organic metal compound, a rubber polymer that is other than a polydimethyl siloxane and has a functional group that is reactive with the organic metal compound, and an inorganic filler that has a functional group that is reactive with the organic metal compound. The transducer is configured by interposing the dielectric film between at least a pair of electrodes. The dielectric film may be produced by preparing a first solution that contains a rubber polymer and an inorganic filler in a solvent that is capable of dissolving the rubber polymer and of chelating an organic metal compound, then preparing a second solution by mixing the organic metal compound into the first solution, and then removing the solvent from the second solution to allow a crosslinking reaction to proceed.