A cooktop assembly includes a countertop defining a cutout portion, and a countertop contact area is disposed proximate a perimeter of the cutout portion on a lower surface of the countertop. A cooktop defines a work portion, and a cooktop contact area is disposed proximate a perimeter of the work portion on an upper surface of the cooktop. An attachment assembly includes a first attachment member positionable on a first side of the cutout portion of the countertop. A second attachment member is positionable on a second side of the cutout portion of the countertop. The first and second sides are opposing sides, and the first and second attachment members are securable to the countertop and the cooktop to engage the countertop contact area with the cooktop contact area thereby securing the cooktop to the countertop.

The present invention makes it possible to easily cook a desired dish by properly controlling heating temperatures of objects to be heated in cookware in accordance with a cooking procedure. The cooking device 10 is provided with: a heating unit 11 for heating cookware C containing objects to be heated such as water, oil, and ingredients; a temperature detection unit 12 for detecting a temperature of the objects to be heated and/or a temperature of a bottom exterior surface of the cookware C; and a control unit 18 for controlling the heating unit 11 on the basis of the temperature detected by the temperature detection unit 12 such that the temperature of the objects to be heated in the cookware C or a surface temperature of a bottom interior surface of the cookware C matches a cooking temperature set in a cooking process included in cooking execution information.

A panel is disclosed. The panel has an exposed surface and a plurality of liquid-repelling elements disposed directly on the exposed surface in a discontinuous pattern. The liquid-repelling elements include a non-hydrophobic material.

A heat treatment method of a substrate includes setting a temperature profile over the course of stabilization to a target temperature after the substrate is loaded as a reference, and controlling a temperature of the hot plate supporting the substrate on the basis of the reference.

Air circulation-type electric roaster includes body, air dispersing plate unit mounted on the body and including bottom plate having at least one through hole and first and second side plates formed respectively on both sides of the bottom plate and each having a plurality of ventholes, power supply unit including first and second power supply units, heating unit including first power connecting unit connected to the first power supply unit, air circulation unit arranged inner side of first long side of the body along its longitudinal direction and including second power connecting unit connected to the second power supply unit, body connecting unit mounted on first short side of the body and including first connecting terminal connected to the second power connecting unit and contactable with the second power supply unit, and cooking unit above the heating unit including cooking surface heated by the heating unit.

Air circulation-type electric roaster includes body, air dispersing plate unit mounted on the body and including bottom plate having at least one through hole and first and second side plates formed respectively on both sides of the bottom plate and each having a plurality of ventholes, power supply unit including first and second power supply units, heating unit including first power connecting unit connected to the first power supply unit, air circulation unit arranged inner side of first long side of the body along its longitudinal direction and including second power connecting unit connected to the second power supply unit, body connecting unit mounted on first short side of the body and including first connecting terminal connected to the second power connecting unit and contactable with the second power supply unit, and cooking unit above the heating unit including cooking surface heated by the heating unit.

A heating device for use in warming the contents of spray bottles. The heating device includes a housing having at least one heating plate on the upper surface thereof. The heating plate includes an electrically operated heating element. The heating plate is controlled by the user via a dial that allows a user to select the temperature of the heating plate. The base of a spray bottle can be positioned directly on the surface of a heating plate so that heat from the heating plate is transferred to the spray bottle in order to warm the contents thereof. The spray bottle is preferably composed of a heat resistant material so that the spray bottle will not degrade or melt upon heating. The housing of the heating device may include one or more storage compartments therein for use in storing various items therein.

A ceramic heater includes a ceramic plate having a wafer placement surface on which a wafer is to be placed, and incorporating a resistance heating element therein, and a ceramic tubular shaft having one end joined to a rear surface of the plate. The tubular shaft has a vertical sectional shape including an S-like portion or a curved portion having an inflection point in at least one position, and includes a through-hole penetrating the tubular shaft from the one end to the other end with an axis extending along the vertical sectional shape of the tubular shaft.

Disclosed are a plasma reactor and a heating apparatus therefor, wherein the heating apparatus comprises: a programmable power supply, a heater assembly, and a bandpass filter assembly, the heater assembly being configured for connecting with the programmable power supply via the bandpass filter assembly, the bandpass filter assembly including a plurality of bandpass filters, wherein the programmable power supply may input, based on match relationships between outputted AC heating powers and conduction frequencies of the bandpass filters BPF, an AC heating power to a matched heater unit to perform heating, thereby achieving zoned temperature control; the disclosures offer a simple circuit structure due to eliminating the need of switch elements, thereby offering a simple control manner.

A sample holder includes: a ceramic substrate including one main surface serving as a sample holding surface; a heat-generating resistor located inside or on an other main surface of the ceramic substrate; a metal member having a first surface bonded to, by a bonding layer, and covering the other main surface of the ceramic substrate, the metal member including a through hole penetrating from the first surface to an opposite surface of the metal member; a lead terminal inserted into the metal member; and a conductive portion located inside the bonding layer, the conductive portion electrically connecting the heat-generating resistor and the lead terminal, the conductive portion including a region which extends in a same direction as the other main surface, and separate from the other main surface of the ceramic substrate.