A display device includes an organic insulating layer, a first inorganic insulating layer, and a second inorganic insulating layer arranged in a first region and a second region, a plurality of pixels arranged in the first region, a protective film arranged in the second region and in contact with an upper surface of the second inorganic insulating layer in the second region, and a groove portion is provided in the organic insulating layer in the second region. A side surface and a bottom surface of the groove portion is covered by the first inorganic insulating layer and the second inorganic insulating layer. The protective film is overlapped with an upper surface of the organic insulating layer and an upper end portion and a part of the side surface of the groove portion.

In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The step of irradiating with the lift-off light includes forming the lift-off light from a plurality of arrayed light sources such that the irradiation intensity of the lift-off light for at least part of the interface between the intermediate region (30i) and the glass base (10) is lower than the irradiation intensity of the lift-off light for the interface between the flexible substrate region (30d) and the glass base (10).

A method of manufacturing a display panel includes preparing a work substrate that includes a mother substrate that has a plurality of cell areas, a light emitting element layer formed in each of the cell areas, and an encapsulation layer formed on each cell area, disposing a plurality of protective films in the cell areas, respectively, that cover the light emitting element layer and the encapsulation layer, cutting the work substrate along cutting lines at an outer side of the protective films of each cell area to form a preliminary display panel, grinding side surfaces of the preliminary display panel, and removing the protective films from each ground preliminary display panel to form the display panel.

Disclosed are a red light and near-infrared light-emitting material and a preparation method thereof, and a light-emitting device including the light-emitting material. The red light and near-infrared light-emitting material contains a compound represented by a molecular formula, aSc.sub.2O.sub.3.Ga.sub.2O.sub.3.bR.sub.2O.sub.3, wherein the element R includes one or two of Cr, Ni, Fe, Yb, Nd or Er; 0.001≤a≤0.6; and 0.001≤b≤0.1. The light-emitting material can be excited by a spectrum having a wide wavelength range (ultraviolet light or purple light or blue light) to emit light with a wide spectrum of 650 nm to 1700 nm or multiple spectra, thus having higher light-emitting intensity.

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

OVJP depositors and techniques for using the same are provided, in which the in-substrate plane velocity of the delivery and confinement flows are both nonzero and parallel to each other across the boundary between the two. These configurations provide improved material utilization efficiency and relaxed fly height tolerances, while achieving acceptable printing resolution and feature uniformity.

OVJP depositors and techniques for using the same are provided, in which the in-substrate plane velocity of the delivery and confinement flows are both nonzero and parallel to each other across the boundary between the two. These configurations provide improved material utilization efficiency and relaxed fly height tolerances, while achieving acceptable printing resolution and feature uniformity.

In a method for producing a vapor deposition mask including a resin mask 20 including resin mask openings 25 corresponding to a pattern to be produced by vapor deposition, and a metal mask 10 including a metal mask opening 15, the metal mask being stacked on one surface of the resin mask, when the plurality of resin mask openings 25 are formed, as to any one resin mask opening 25a of the plurality of resin mask openings 25, the resin mask opening 25 is formed such that in a thicknesswise cross section of the resin mask, an acute angle (θ1) formed by one inner wall surface forming the one resin mask opening and the other surface of the resin mask is different from an acute angle (θ2) formed by the other inner wall surface forming the one resin mask opening and the other surface of the resin mask.