A display device includes a plurality of picture elements, wherein a first electrode is formed in each of the plurality of picture elements, a cover layer is formed such that an opening of the first electrode is formed, a spacer in a layer identical to the cover layer is provided between two of the first electrodes, the spacer is formed with a height greater than a height of the cover layer, and an outer edge portion of the spacer is spaced from an outer edge portion of the cover layer.

Provided is a light-emitting device including a light-emitting element including a first electrode, a second electrode, and a quantum dot layer between the first electrode and the second electrode, wherein, in the quantum dot layer, quantum dots each including a core, a shell covering the core, and a ligand coordinated with a surface of the shell and having defect compensation properties are layered.

A vapor deposition mask (100) including: a magnetic metal member (20) including at least one first opening (25); and a layered member (30) that is arranged on the magnetic metal member (20) so as to cover the at least one first opening (25) and has a plurality of second openings (13) located in the at least one first opening (25), wherein: the layered member (30) includes a first layer (m1) and a second layer (m2) that is arranged between the first layer (m1) and the magnetic metal member (20); and in the at least one first opening (25), at a first temperature that is greater than or equal to room temperature, an elastic modulus E1 of the first layer, a thickness a1 of the first layer, an internal stress σ1 of the first layer, an elastic modulus E2 of the second layer, a thickness a2 of the second layer and an internal stress σ2 of the second layer (where σ1 and σ2 are positive for tensile stress) satisfy Expressions (1) and (2) below:

σ1/E1−σ2/E2<0  (1)

0<a1×σ1+a2×σ2  (2).

The display device includes: a display area; a first peripheral area disposed outside the display area; a second peripheral area disposed outside the first peripheral area;

an inner dam disposed in the first peripheral area; an outer dam disposed outside the inner dam in the first peripheral area; a resin part formed between the inner dam and the outer dam so as to be higher than the inner dam and the outer dam; and a sealing film disposed so as to overlap with the display area in a plan view. An outer edge of the sealing film overlaps with the resin part or the outer dam in a plan view.

According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The step of irradiating with the lift-off light includes the first light scanning for scanning the interface in a first direction with the light in the form of a line beam, and the second light scanning for scanning the interface in a second direction with the light. In each of the first and second light scanning, the irradiation intensity is modulated such that the intensity for at least part of the interface between the intermediate region (30i) and the glass base (10) is lower than the irradiation intensity for the interface between the flexible substrate regions (30d) and the glass base (10).

A film formation apparatus according to an embodiment comprising: a substrate holder for holding a substrate in a standing position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor deposition layer is formed; and an evaporation source to supply a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The apparatus further comprises an adjustment means for reducing a variation in the thickness of the vapor deposition layer, which results from the inclination of the substrate.

A manufacturing method of a deposition mask includes: a resin-layer forming step of forming a resin layer on one surface of a substrate by applying a resin solution to the surface of the substrate; a step of forming a non-contact area that is not in contact with the surface of the substrate in the resin layer by removing at least a part of the substrate; a step of bringing the resin layer into contact with a liquid or heating the resin layer after the non-contact area has been formed in the resin layer; and a resin-layer processing step of forming second opening in the resin layer by processing the resin layer after the step of bringing the resin layer into contact with a liquid or heating the resin layer.

An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality or TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

A vapor deposition method for depositing evaporated materials on a substrate using a mask includes arranging a mask frame and correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed. The mask frame faces the substrate so that a first side is higher than a second side in a direction of gravity. The mask frame is provided with a mask and has the first side and the second side facing each other.

A display device is provided with a display region and a frame region surrounding the display region. The display region includes a light-emitting element layer that includes a plurality of light-emitting elements, a TFT layer provided below the light-emitting element layer to drive the light-emitting elements, and a sealing layer covering the light-emitting element layer. The light-emitting element layer is provided with a plurality of light-emitting layers, and each of the light-emitting layers contains a hindered amine compound and/or a derivative of a hindered amine compound.