An organic electronic element manufacturing method is a method of manufacturing an organic electronic element (1) having flexibility using a roll-to-roll process, including a first electrode forming step in which a first electrode (21) is pattern-formed onto a flexible substrate (10), a functional layer forming step in which a functional layer (23) containing an organic material is pattern-formed onto the first electrode (21), and a mask forming step in which a mask element (30) having flexibility is formed on the substrate (10) such that it has an opening on at least a portion of the functional layer (23) and at least a portion of the first electrode (21) with the functional layer (23) therebetween and covers edge portions (21a and 23a) on at least one side of the first electrode (21) and the functional layer (23).

An organic electronic element manufacturing method is a method of manufacturing an organic electronic element (1) having flexibility using a roll-to-roll process, including a first electrode forming step in which a first electrode (21) is pattern-formed onto a flexible substrate (10), a functional layer forming step in which a functional layer (23) containing an organic material is pattern-formed onto the first electrode (21), and a mask forming step in which a mask element (30) having flexibility is formed on the substrate (10) such that it has an opening on at least a portion of the functional layer (23) and at least a portion of the first electrode (21) with the functional layer (23) therebetween and covers edge portions (21a and 23a) on at least one side of the first electrode (21) and the functional layer (23).

A method and apparatus to attach an Electroluminescent wire and power inverter to a helmet is disclosed. Dabs of hot glue are injected at various locations to form a pattern on a helmet top surface. Segments of heat shrink tubing are inserted into the injected hot glue on the surface to permit the heat shrink tubing segments to shrink and adhere to the helmet. Electroluminescent wire is inserted into the partially shrunk segments of heat shrink tubing. A power inverter is attached to the helmet and connected to the electroluminescent wire to create a light pattern.

A method and apparatus to attach an Electroluminescent wire and power inverter to a helmet is disclosed. Dabs of hot glue are injected at various locations to form a pattern on a helmet top surface. Segments of heat shrink tubing are inserted into the injected hot glue on the surface to permit the heat shrink tubing segments to shrink and adhere to the helmet. Electroluminescent wire is inserted into the partially shrunk segments of heat shrink tubing. A power inverter is attached to the helmet and connected to the electroluminescent wire to create a light pattern.

According to an embodiment, a substrate with an electrode is a substrate with an electrode 32 for manufacturing an organic device 10 including a first electrode 14, an organic functional layer 16, and a second electrode 18. The substrate with an electrode includes a support substrate 34, a first electrode provided on an inner side of a device formation area DA on a surface 34a of the support substrate 34, and an antistatic conductive portion 36 provided on the surface described above and electrically connected to the first electrode.

According to a method for producing a flexible OLED device of the present disclosure, a multilayer stack (100) is provided, the multilayer stack including a base (10), a functional layer region (20) which includes a TFT layer and an OLED layer, a flexible film (30) provided between the base and the functional layer region and supporting the functional layer region, and a release layer (12) provided between the flexible film and the base and bound to the base. The release layer is irradiated with lift-off light (216) transmitted through the base, whereby the flexible film is delaminated from the release layer. The release layer is made of a polycrystalline of tantalum nitride.

An organic EL display device (100) includes an element substrate including a substrate, a plurality of organic EL elements supported by the substrate and respectively located in the plurality of pixels, and a bank layer (48) defining each of the plurality of pixels; and a thin film encapsulation structure (10) covering the plurality of pixels. The bank layer has an inclining surface enclosing each of the plurality of pixels. The thin film encapsulation structure includes a first inorganic barrier layer (12), an organic barrier layer (14) including a plurality of solid portions in contact with a top surface of the first inorganic barrier layer and distributed discretely, and a second inorganic barrier layer (16) in contact with the top surface of the first inorganic barrier layer and top surfaces of the plurality of solid portions of the organic barrier layer. The plurality of solid portions include pixel periphery solid portions (14a) each extending, on the first inorganic barrier layer, from a portion on the inclining surface to a peripheral area in the corresponding pixel of the plurality of pixels, the pixel periphery solid portions each extending along the entirety of a circumference of the pixel. A refractive index n0 of the organic barrier layer is smaller than a refractive index n1 of the second inorganic barrier layer, and the top surfaces of the pixel periphery solid portions each have an inclination angle a larger than, or equal to, 20 degrees.

A light emitting device that includes: a plurality of light emitting elements arranged at different locations in a common plane, each light emitting element including: at least one layer of a semiconductor material; a first electrical terminal located at a first location; a second electrical terminal located at a second location; and a third electrical terminal located at a third location; a first electrode layer including one or more electrodes; a second electrode layer including one or more electrodes; a third electrode layer including one or more electrodes; a first electrically insulating layer disposed between the plurality of light emitting elements and also disposed between the first and second electrode layers; and a second electrically insulating layer disposed between the plurality of light emitting elements and also disposed between the second and third electrode layers.

A light emitting device that includes: a plurality of light emitting elements arranged at different locations in a common plane, each light emitting element including: at least one layer of a semiconductor material; a first electrical terminal located at a first location; a second electrical terminal located at a second location; and a third electrical terminal located at a third location; a first electrode layer including one or more electrodes; a second electrode layer including one or more electrodes; a third electrode layer including one or more electrodes; a first electrically insulating layer disposed between the plurality of light emitting elements and also disposed between the first and second electrode layers; and a second electrically insulating layer disposed between the plurality of light emitting elements and also disposed between the second and third electrode layers.

A method for producing an organic EL device in this disclosure includes the steps of providing an element substrate including a substrate and a plurality of organic EL devices arranged on the substrate; and forming a thin film encapsulation structure over the element substrate. The step of forming the thin film encapsulation structure includes the steps of forming a first inorganic barrier layer over the element substrate; condensing a photocurable resin on the first inorganic barrier layer; irradiating a plurality of selected regions of the photocurable resin with a laser beam to cure at least a part of the photocurable resin, thus to form a photocurable resin layer; removing an uncured part of the photocurable resin; and forming a second inorganic barrier layer, covering the photocurable resin layer, on the first inorganic barrier layer.