A snow guard assembly heated within one or more snow guard tubes. Heating of the snow guard tube prevents excessive accumulation of snow and helps prevent snow build up and spill over above the top of the snow guard. The tubes can be length-wise separable to place and service the heating elements. The heating element can be standard heat tape or infrared LEDs. The snow guard tubes can optionally have a non-uniform cross-sectional thickness to direct the heat more efficiently in a desired orientation. The interior of the snow guard tubes can be selectively coated with infrared absorbing or reflective material to direct the heat in a desired orientation when infrared LEDs are used as a heat source. The snow guard can be attached to many types of roof surfaces including tile roofs, metal roofs with or without standing seams, and shingle roofs.

A heating panel including a thermally conductive (e.g. metal) layer, a laminar heating element disposed over a framing-facing side of the thermally conductive layer, an insulation layer disposed over the laminar heating element, and a room-facing surface layer disposed over at least the room-facing side of the thermally conductive layer. A method for heating a room may include installing at least one heating panel on a ceiling of the room and providing power to the heating element to generate heat that radiates into the room. The panel may be part of a heating system including a controller, such as a thermostat, for regulating power to the heating panel. A plurality of heating panels or a plurality of heating zones in one or more of the panels may be independently controllable.

The present invention relates to a blackbody radiation source. The blackbody radiation source comprises a blackbody radiation cavity and a plurality of carbon nanotubes. The blackbody radiation cavity comprises an inner surface. The plurality of carbon nanotubes are located on the inner surface. An extending direction of each of the carbon nanotubes is substantially perpendicular.

The present disclosure relates to aerosol delivery devices, methods of forming such devices, and elements of such devices. In some embodiments, the present disclosure provides devices configured for vaporization of an aerosol precursor composition through radiant heating.

The radiant heat source may be a laser diode or further element suitable for providing electromagnetic radiation, and heating may be carried out within a radiation-trapping chamber. In some embodiments, an interior of such chamber may be configured as a black body or as a white body.

A termination assembly for a heater assembly includes a plurality of resistive heaters arranged in discrete power phases, each resistive heater comprising a resistive heating element surrounded by dielectric material and a sheath. The termination assembly includes a plurality of electrically nonconductive members. Each electrically nonconductive member includes a plurality of apertures configured to receive power pins of the plurality of resistive heaters. The termination assembly includes a plurality of connectors configured to connect the power pins to the electrically nonconductive members. Each electrically nonconductive member includes a number of the plurality of connectors corresponding to a number of power pins being terminated. The termination assembly includes an electrical circuit embedded in or disposed on at least one of the plurality of electrically nonconductive members.

A heating element for use in a system for melting materials during the production of a glass or ceramic material is disclosed. A method for melting materials during the production of a glass or ceramic material is also disclosed. The heating element comprises a first coupling member configured to couple to a first side of the interior of a melt tank; a second coupling member configured to couple to a second side of the interior of the melt tank; and at least one elongate strip extending between the first coupling member and the second coupling member. The at least one elongate strip is integral with the first coupling member and the second coupling member. The heating element is configured such that during a heating operation, current flows between the first coupling member and the second coupling member of the heating element, along the at least one elongate strip to thereby radiate heat to materials located within the interior of the melt tank.

An apparatus for processing a substrate may include a processing module including at least one process chamber for processing a desired process on a substrate, an index module for transferring the substrate from an outside into the processing module, and a drying unit for removing a moisture or undesired gases from the at least one process chamber. The drying unit may remove the moisture or the undesired gases from components newly installed in the at least one process chamber.

Systems and methods are provided for radiant heating by PTC radiant patches. A radiant heating system for warming an occupant of an enclosed space includes patches to radiate heat into the enclosed space toward the occupant. A power supply supplies electric power to the patches. A controller controls the electric power supplied to the patches based on a temperature in the enclosed space and locations of the patches within the enclosed space.

The semiconductor wafer is preheated at a preheating temperature, and then irradiated with a flash of light from a flash lamp. The upper radiation thermometer measures a temperature of a front-surface of a semiconductor wafer which is raised by irradiation with a flash of light. When the front-surface temperature of the semiconductor wafer measured by the upper radiation thermometer reaches the target temperature, the supply of a current to the flash lamps is stopped to lower the front-surface temperature of the semiconductor wafer. Since the supply of a current to the flash lamps is stopped when the measured temperature of the front-surface of the semiconductor wafer reaches the target temperature, the front-surface temperature of the semiconductor wafer can be accurately raised to the target temperature regardless of the front-surface state and reflectance of the semiconductor wafer.

An aerosol-generating article may comprise a liquid storage portion containing a liquid aerosol-forming substrate, and a hydrochromic material provided on the liquid storage portion. The hydrochromic material has a first colour when in the presence of or when in contact with the liquid aerosol-forming substrate and a second colour when in the absence of or when not in contact with the liquid aerosol-forming substrate. An aerosol-generating system may comprise the aerosol-generating article, an aerosol-generating element, and an aerosol-generating device. An aerosol-generating device may comprise an electrical power supply, an electronic photosensor, and a controller configured to control a supply of electrical power from the electrical power supply based on a value of an optical property sensed with the electronic photosensor.