H05H2242/10

LIQUID COOLED PLASMA ARC TORCH

A plasma arc torch includes a cathode extending along an axis of the torch, a pilot arc conductor, and a nozzle body. A first fluid conduit and second fluid conduit extend parallel to the axis of the torch. A first offset fitting includes a first duct coupled to and in fluid communication with the first fluid conduit, and a second duct in fluid communication with the first duct and outwardly radially offset from the first duct and extending away from the first duct in a proximal direction. A second offset fitting includes a third duct coupled to and in fluid communication with the second fluid conduit, and a fourth duct in fluid communication with the third duct and outwardly radially offset from the third duct and extending away from the third duct in the proximal direction. A spring compression plug electrically connects the pilot arc conductor to the nozzle body.

High-current conduction cooled superconducting radio-frequency cryomodule

A high-current, compact, conduction cooled superconducting radio-frequency cryomodule for particle accelerators. The cryomodule will accelerate an electron beam of average current up to 1 ampere in continuous wave (CW) mode or at high duty factor. The cryomodule consists of a single-cell superconducting radio-frequency cavity made of high-purity niobium, with an inner coating of Nb.sub.3Sn and an outer coating of pure copper. Conduction cooling is achieved by using multiple closed-cycle refrigerators. Power is fed into the cavity by two coaxial couplers. Damping of the high-order modes is achieved by a warm beam-pipe ferrite damper.

MATCHLESS PLASMA SOURCE FOR SEMICONDUCTOR WAFER FABRICATION
20200253034 · 2020-08-06 ·

A matchless plasma source is described. The matchless plasma source includes a controller that is coupled to a direct current (DC) voltage source of an agile DC rail to control a shape of an amplified square waveform that is generated at an output of a half-bridge transistor circuit. The matchless plasma source further includes the half-bridge transistor circuit used to generate the amplified square waveform to power an electrode, such as an antenna, of a plasma chamber. The matchless plasma source also includes a reactive circuit between the half-bridge transistor circuit and the electrode. The reactive circuit has a high-quality factor to negate a reactance of the electrode. There is no radio frequency (RF) match and an RF cable that couples the matchless plasma source to the electrode.

Matchless plasma source for semiconductor wafer fabrication

A matchless plasma source is described. The matchless plasma source includes a controller that is coupled to a direct current (DC) voltage source of an agile DC rail to control a shape of an amplified square waveform that is generated at an output of a half-bridge transistor circuit. The matchless plasma source further includes the half-bridge transistor circuit used to generate the amplified square waveform to power an electrode, such as an antenna, of a plasma chamber. The matchless plasma source also includes a reactive circuit between the half-bridge transistor circuit and the electrode. The reactive circuit has a high-quality factor to negate a reactance of the electrode. There is no radio frequency (RF) match and an RF cable that couples the matchless plasma source to the electrode.

Dielectric barrier discharge plasma method and apparatus for synthesizing metal particles

A dielectric barrier discharge (DBD) plasma apparatus for synthesizing metal particles is provided. The DBD plasma apparatus includes an electrolyte vessel for receiving an electrolyte solution comprising metal ions; an electrode spaced-apart from the electrolyte vessel; a dielectric barrier interposed between the electrolyte vessel and the electrode such that, when the electrolyte solution is present in the electrolyte vessel, the dielectric barrier and an upper surface of the electrolyte solution are spaced-apart from each other and define a discharge area therebetween; and gas inlet and outlet ports in fluid communication with the discharge area such that supplying gas in the discharge area while applying an electrical potential difference between the electrode and the electrolyte solution cause a plasma to be produced onto the electrolyte solution, the plasma interacting with the metal ions and synthesizing metal particles. A method for synthesizing metal particles using a DBD plasma apparatus is also provided.

COOLING PLATE ASSEMBLY FOR PLASMA WINDOWS POSITIONED IN A BEAM ACCELERATOR SYSTEM
20240107653 · 2024-03-28 ·

A beam accelerator system operable to produce a medical isotope, including an ion accelerator that generates an ion beam; a low-pressure chamber; an anode adjacent and fluidly connected to the low-pressure chamber; a plasma window adjacent and fluidly connected to the anode; and a cathode housing adjacent and fluidly connected to the plasma window. The plasma window has a plurality of plates, each plate having an aperture that is aligned with an aperture in one or more adjacent plates to form a plasma channel. One or more plates in the plurality of plates includes a unitary plate having an aperture therein, and one or more cooling channels entering the unitary plate at a first side of the unitary plate and exiting the unitary plate at a second side of the unitary plate. The one or more cooling channels run through a thickness of the unitary plate.

Plasma generation device and plasma head cooling method

A plasma generation device includes a plasma head configured to eject plasma gas that is plasmatized, a gas supply device configured to supply gas serving as the plasma gas to the plasma head, a pair of electrodes that is provided in the plasma head, the pair of electrodes being configured to perform discharging for a part of the gas supplied from the gas supply device to generate the plasma gas, a temperature sensor that is provided in the plasma head, the temperature sensor being configured to measure a temperature of the plasma head; and a control device, in which the control device executes a cooling process of cooling the plasma head by causing the gas supply device to continue supply of the gas until the temperature sensor measures a temperature equal to or less than a predetermined value after the discharging of the pair of electrodes is stopped.

Liquid cooled plasma arc torch

A plasma arc torch includes a cathode extending along an axis of the torch, a pilot arc conductor, and a nozzle body. A first fluid conduit and second fluid conduit extend parallel to the axis of the torch. A first offset fitting includes a first duct coupled to and in fluid communication with the first fluid conduit, and a second duct in fluid communication with the first duct and outwardly radially offset from the first duct and extending away from the first duct in a proximal direction. A second offset fitting includes a third duct coupled to and in fluid communication with the second fluid conduit, and a fourth duct in fluid communication with the third duct and outwardly radially offset from the third duct and extending away from the third duct in the proximal direction. A spring compression plug electrically connects the pilot arc conductor to the nozzle body.

MATCHLESS PLASMA SOURCE FOR SEMICONDUCTOR WAFER FABRICATION
20190215942 · 2019-07-11 ·

A matchless plasma source is described. The matchless plasma source includes a controller that is coupled to a direct current (DC) voltage source of an agile DC rail to control a shape of an amplified square waveform that is generated at an output of a half-bridge transistor circuit. The matchless plasma source further includes the half-bridge transistor circuit used to generate the amplified square waveform to power an electrode, such as an antenna, of a plasma chamber. The matchless plasma source also includes a reactive circuit between the half-bridge transistor circuit and the electrode. The reactive circuit has a high-quality factor to negate a reactance of the electrode. There is no radio frequency (RF) match and an RF cable that couples the matchless plasma source to the electrode.

Apparatus for Treating Water using a Plasma Source that is Protected from Water
20240199451 · 2024-06-20 ·

Apparatus for treating water is provided where the apparatus includes a reaction chamber having an air-water interface and a plasma applicator disposed in air in proximity to the air-water interface. The plasma applicator includes a solid dielectric plate sandwiched between a first electrode and a second electrode, where the first electrode is closer to the water than the second electrode. The plasma applicator further includes a first insulating layer disposed on the first electrode. The apparatus is configured to generate a plasma between the first insulating layer and the air-water interface during operation.