Patent classifications
H05K1/16
THIN FILM-BASED MICROFLUIDIC ELECTRONIC DEVICE, METHOD OF FORMING THEREOF, AND SKIN AND TISSUE ADHESIVE APPLICATIONS
There is provided a method of forming a thin film-based microfluidic electronic device. The method includes: providing a first elastomeric thin film layer on a substrate; depositing a first elastomer on the first elastomeric thin film by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer; providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel; providing a sacrificial layer on the second elastomeric thin film; depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel; and electrically connecting the conductor to an electronic component. The thin film-based microfluidic electronic device is a tissue or skin adhesive sensor including a skin adhesive acoustic device.
METHOD FOR MANUFACTURING A BIOLOGICAL FLUID SENSOR
The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.
Multilayer wiring board and probe card including same
Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.
MAGNETIC MATERIAL FILLED PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARD STATORS
A dielectric substrate may support conductive traces that form windings for a least one pole of a planar armature of an axial flux machine. At least a portion of the dielectric substrate, which is adapted to be positioned within an annular active area of the axial flux machine, may include a soft magnetic material. Such a planar armature may be produced, for example, by forming the conductive traces on the dielectric substrate, and filling interstitial gaps between the conductive traces with at least one epoxy material in which the soft magnetic material is embedded.
Stackable RF filter for a receiver or transmitter
A receiver or transmitter designed for a broad range of frequencies requires a pre-select filter for incoming signals or a post-select filter for outgoing signals to minimize spurious signal responses. In conventional receivers, several discrete RF filters are used and a switched filter bank is created utilizing a large amount of space. A filter bank comprising a plurality of stacked shielded filters would enable different filter technologies and topologies to be used together, as other passive and active circuits may be combined into the one surface mountable component in order to save on PCB space.
Component carrier with embedded component exposed by blind hole
The present invention relates to an embedded printed circuit board including: an insulation substrate including a cavity; a sensor device disposed on the cavity; an insulating layer disposed on the insulation substrate, having an opening part exposing the sensor device; and a pad part disposed on the lower surface of the opening part exposing the sensor device.
Eyewear with wireless charging means
Eyewear (100) comprising at least one lens (110,120), a lens frame (111,121), a battery (170) and means for wireless charging of said battery (170), which wireless charging means comprises a receiver coil (181) arranged to be remotely powered by a corresponding transmitter coil (340) in a separate charging device (300). The invention is characterised in that the receiver coil (181) is arranged so that it encircles at least one of said one or several lenses (110,120), forming part of or being enclosed in said lens frame (111,121), whereby light passing through the at least one lens (110,120) will also pass through a coil hole.
METHODS AND APPARATUS FOR ELECTRONIC VOTING
Aspects of the present disclosure relate to an apparatus comprising: a substrate; communication circuitry deposited on said substrate; and ballot circuitry deposited on said substrate. The ballot circuitry comprises: a plurality of voting circuitry elements, each voting circuitry element being responsive to a voting operation to change a conductive state of that voting circuitry element; and logic circuitry communicatively coupled with each of the plurality of voting circuitry elements and with the communication circuitry. The logic circuitry is configured to: detect the conductive state of each of the plurality of voting circuitry elements; and transmit, via the communication circuitry and based on the conductive state of each of the plurality of voting circuitry elements, a voting result.
METHODS AND APPARATUS FOR ELECTRONIC VOTING
Aspects of the present disclosure relate to an apparatus comprising: a substrate; communication circuitry deposited on said substrate; and ballot circuitry deposited on said substrate. The ballot circuitry comprises: a plurality of voting circuitry elements, each voting circuitry element being responsive to a voting operation to change a conductive state of that voting circuitry element; and logic circuitry communicatively coupled with each of the plurality of voting circuitry elements and with the communication circuitry. The logic circuitry is configured to: detect the conductive state of each of the plurality of voting circuitry elements; and transmit, via the communication circuitry and based on the conductive state of each of the plurality of voting circuitry elements, a voting result.
Circuit board and method for manufacturing the same
A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.