The disclosed current-distribution inductor may include (1) a magnetic core and (2) a conductor electrically coupled between a power source and an electrical component of a circuit board, wherein the conductor comprises (A) a bend that passes through the magnetic core and (B) a flying lead that extends from the bend to the electrical component of the circuit board and runs parallel with the circuit board. Various other apparatuses, systems, and methods are also disclosed.

A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

Systems and methods for printed multifunctional skins are disclosed herein. In one embodiment, an aerodynamic apparatus includes an aerodynamic structure having a first surface exposed to an outside environment, and a second surface exposed to an inside environment. A printed sensor is carried by the first surface of the aerodynamic structure, electronic components are carried by the second surface of the aerodynamic structure, and at least one printed conductive trace is carried by the first surface and the second surface. The printed conductive trace electrically connects the printed sensor with the electronics.

Systems and methods for printed multifunctional skins are disclosed herein. In one embodiment, an aerodynamic apparatus includes an aerodynamic structure having a first surface exposed to an outside environment, and a second surface exposed to an inside environment. A printed sensor is carried by the first surface of the aerodynamic structure, electronic components are carried by the second surface of the aerodynamic structure, and at least one printed conductive trace is carried by the first surface and the second surface. The printed conductive trace electrically connects the printed sensor with the electronics.

An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

The present invention provides a packaging method and a packaging structure for a cascode power electronic device, in which a hetero-multiple chip scale package is used to replace the traditional die bonding and wire bonding packaging method. The cascode power electronic device can reduce the inductance resistance and thermal resistance of the connecting wires and reduce the size of the package; and increase the switching frequency of power density. The chip scale package of the present invention uses more than one gallium nitride semiconductor die, more than one diode, and more than one metal oxide semiconductor transistor. The package structure can use TO-220, quad flat package or other shapes and sizes; the encapsulation process of the traditional epoxy molding compounds can be used in low-power applications; and the encapsulation process of ceramic material can be used in high-power applications.

A touch sensor pattern includes: a plurality of detection electrodes; a plurality of lead wires that are connected to the plurality of detection electrodes and a plurality of external connection terminals that are connected to the plurality of lead wires, in which each of the plurality of external connection terminals includes a first fine metal wire having a smaller line width than each of the plurality of lead wires, and an area per unit length of at least a part of each of the plurality of external connection terminals in an extension direction in a plan view is 5.5 times or less an area per unit length of each of the plurality of lead wires in a plan view.

A PCB for wireless power transfer includes an antenna and the antenna includes a coil. A method for manufacturing the PCB includes providing a prefabricated PCB, the prefabricated PCB including a PCB design and a first area and providing a first sheet of a conductive metal for the first area. The method includes applying an etch resistant coating on a coil area within the first area and laser cutting the first sheet within the coil area, based on a laser cutting path for a first plurality of turns for a first layer of the coil, the first geometry configured wireless power transfer. The method further includes substantially exposing the first sheet to an etching solution, the etching solution substantially removing first portions of the conductive metal from the substrate to define, at least, first turn gaps between at least two of the first plurality of turns.

The present invention relates to an energy storage device comprising a flexible substrate comprising at least two patterned regions spaced apart from one another along the length of the flexible substrate. Each patterned region comprises at least one groove extending in the longitudinal direction of the substrate (web direction) having a first and a second face, wherein the first and second faces are each coated with a conductor such that there is no direct electrical communication between the conductor on the first and second faces, the at least one groove contains a material for storing electrical potential energy (e.g. capacitive material), the first and the second face of the at least one groove of each patterned region are each in electrical connection with an electrical conductor at opposing edges of the flexible substrate, and the first and the second patterned region are electrically connectable to one another.