A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least one pair of first electrical conductors. The magnetic core portion comprises at least one core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.

Rotary motors incorporating flexible printed circuit boards are described. A motor may include a stator assembly and a rotor assembly co-radially arranged with the stator assembly and configured to rotate relative to the stator assembly. At least one of the stator assembly and the rotor assembly may include a flexible printed circuit board having a base layer and a plurality of conductive elements formed on the base layer.

A circuit interrupter including a line conductor, a printed-circuit board, and a test circuit. The printed-circuit board coil is embedded on a printed circuit board. The printed circuit board includes a slot through the printed-circuit board coil, wherein the line conductor is received by the printed-circuit board coil. The test circuit is electrically connected to the printed-circuit board coil. The test circuit is configured to determine a condition of the line conductor based on a signal of the printed-circuit board coil.

Methods of manufacture are described. A method includes forming a first cavity in a substrate and placing a backplane in the first cavity. At least one layer of dielectric material is formed over the substrate and the backplane. A second cavity is formed in the at least one layer of the dielectric material to expose at least a portion of a surface of the backplane. A heat conductive material is placed in the second cavity and in contact with the at least the portion of the surface of the backplane.

A heater for an aerosol-generating device is provided, the heater including: a flexible electrically insulating substrate including a first portion, a second portion, and a fourth portion, in which the flexible electrically insulating substrate is rolled into a tube; control electronics disposed on the first portion of the flexible electrically insulating substrate; a heating element including an induction coil and being disposed on the second portion of the flexible electrically insulating substrate; and a susceptor element arranged on the fourth portion of the flexible electrically insulating substrate. An aerosol-generating device is also provided, including a cavity to receive an aerosol-generating article including an aerosol-forming substrate, and the heater. A system is also provided, including the aerosol-generating device and the aerosol-generating article including the aerosol-forming substrate.

There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.

The present description concerns a device comprising at least one chip in a package, the package comprising a support, having the at least one chip resting thereon, and a protection layer covering the at least one chip, the support comprising a stack of layers made of an insulating material, a transformer being formed in the support by first and second conductive tracks.

A wiring board includes an interconnect structure. The interconnect structure includes a pad, an insulating layer covering the pad, a magnetic resin disposed on the pad in the insulating layer, and a via interconnect penetrating the magnetic resin and electrically connected to the pad.

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

The present invention provides a high efficiency, high density GaN-based power converter comprising: a transformer; a magnetic coupler; a primary switch; a secondary switch; a primary controller; a secondary controller; a multi-layered print circuit board (PCB) comprising: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the transformer, the coupler, a primary switch, a secondary switch, a primary controller and a secondary controller. The power converter further comprises a pair of ferrite cores being fixed to a top surface and a bottom surface of the PCB respectively and commonly shared by the transformer and the coupler.