A system to access one or more user profiles that govern one or more vehicle functions. The system cooperates with a processor and verification module which are adapted to verify, using one or more of biometric information, gesture recognition, facial recognition and device identification information, that a user has authority to access the one or more user profiles, where the one or more profiles are stored in one or more of a vehicle, a cloud and a communications device. An edit module is further provided and adapted to allow the user to make one or more edits to the one or more user profiles.

A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.

Various embodiments of the present disclosure provide a framework for obfuscation of a printed circuit board (PCB). In one example, an embodiment provides for generating a plurality of connections interconnecting a plurality of components of the PCB using additive manufacturing, permuting, using a micro electro-mechanical systems (MEMS) device, a first set of connections interconnecting a first component with a second component in the PCB, integrating the MEMS device into the PCB such that the MEMS device covers a second set of connections from an x-ray probe, probing the PCB using x-ray simulation, and iteratively adjusting the permutation of the first set of connections and the integration of the MEMS device using a result of the x-ray simulation to reduce the detectability of the first and second connections based on the result of the x-ray simulation.

Provided are a chip and a pin line-out design method therefor, which are applied to a BGA packaged chip. The method includes: according to pin position information and pin definition information of a chip, determining a number of circuit board layers required for pin line-out of the chip (S1); allocating line-out layers to pins of the chip in their respective circuit boards (S2); and according to a pin density and transmission line width requirement of the chip, determining a specification of a via hole in each circuit board for leading the pin of the chip out to the corresponding line-out layer, to perform a corresponding line-out design on the basis of the via hole (S3). It may be seen that the described unified pin line-out design for the BGA packaged chip is more refined, and the quality of the line-out design of the pins of the chip is ensured.

Various embodiments include a method for producing electronic assemblies. The method may include: applying a fluid printing medium in a structured manner using a printing device multiple times consecutively in a sequential series of individual printing steps; measuring a rheological property of the printing medium in an automated repeated series of individual measurement steps during or between the individual printing steps; executing a computer-implemented rheological model for the execution of the individual printing steps, using the repeatedly measured rheological property as a variable input parameter; determining a favorable value for a selected printing parameter with the rheological model based on the currently measured rheological property; and automatically setting the determined favorable value for the selected printing parameter.

A silkscreen layer of a printed circuit board is herein disclosed. The silkscreen layer includes PCB elements and polarity markings thereon. Each polarity marking is formed from a first end line segment, a middle line segment perpendicularly connected to the first end line segment, and a second end line segment perpendicularly connected to the middle line segment. In use, each polarity marking indicates a polarity of a respective PCB element of the plurality of PCB elements and the plurality of polarity markings are the only polarity markings on the silkscreen layer. Further disclosed is a method of removing the impedance requirement from a PCB design.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.

The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.

A method for increasing the decoupling capacitance in a microelectronic circuit. The method comprises producing a circuit design of the microelectronic circuit, analyzing the produced circuit design, and subsequently filling gaps in the circuit design by cells with decoupling capacitor.

The present disclosure describes printed circuit board performance evaluation techniques. In some cases, a printed circuit board performance evaluation process may include determining a first set of electrical properties associated with an interface between components of a printed circuit board, where the interface is disposed on an internal or external layer of the printed circuit board. After selective application of a sheet of dielectric material to a portion of a transmission line in the interface, a second set of electrical properties associated with the interface may be determined. The first set of electrical properties may be compared to the second set of electrical properties to evaluate printed circuit board performance. In other cases, the interface may include a trace inductor, and electrical properties of the interface before and after application of a ferrous material may be compared to evaluate printed circuit board performance.