Patent classifications
H05K3/0005
METHODS FOR DISPENSING A LIQUID OR VISCOUS MATERIAL ONTO A SUBSTRATE
Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.
TOPOGRAPHY-BASED DEPOSITION HEIGHT ADJUSTMENT
A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpiece onto which the component is to be mounted. The method further comprises forming a plurality of deposits (110) of a viscous medium on at least one of the mounting and local surfaces, wherein each of the plurality of deposits has a height (/½, /½, h3) based on the obtained information, and is formed by individually applying at least one droplet (234) of the viscous medium (232) using non-contact dispensing. The method further comprises placing the component on the substrate, such that the plurality of deposits of viscous medium forms a connection between the component and the workpiece.
COMPONENT PLACEMENT METHOD AND INFORMATION PROCESSING APPARATUS
A processor of an information processing apparatus displays a first component in a state in which a first terminal of the first component is located on a second terminal of a second component. The processor displays, along a designated route, a first wiring pattern for connecting the second terminal to the first terminal and moves the first component to a first distal end of the first wiring pattern. The processor determines whether a pattern area of the first wiring pattern or a component area of the first component which is placed at a second distal end of the designated route overlaps any of first areas of already placed components or second areas of already wired wiring patterns. The processor finalizes placement of the first component and the first wiring pattern upon determining that the pattern area and the component area overlap none of the first areas and the second areas.
Method for reducing influence of remote reference power noise on signal quality
A method for reducing influence of a remote reference power noise on signal quality is provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.
PRINTED CIRCUIT BOARD CAPACITOR STRUCTURES
One example includes a printed circuit board (PCB) structure. The PCB structure includes a first dereferenced microstrip and a first capacitor pad contacting the first dereferenced microstrip. The PCB structure includes a second dereferenced microstrip and a second capacitor pad contacting the second dereferenced microstrip. The PCB structure also includes a capacitor including a first terminal contacting the first capacitor pad and a second terminal contacting the second capacitor pad.
ACCESS AND PORTABILITY OF USER PROFILES STORED AS TEMPLATES
A system to access one or more user profiles that govern one or more vehicle functions. The system cooperates with a processor and verification module which are adapted to verify, using one or more of biometric information, gesture recognition, facial recognition and device identification information, that a user has authority to access the one or more user profiles, where the one or more profiles are stored in one or more of a vehicle, a cloud and a communications device. An edit module is further provided and adapted to allow the user to make one or more edits to the one or more user profiles.
SPREAD WEAVE INDUCED SKEW MINIMIZATION
A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.
Method for designing layout of card edge connector and server card
A method for designing a layout of a card edge connector and a server a card are provided. The method includes: determining, based on a type of a GND pin of a card edge connector and space between the card edge connector and GND vias, the number of GND vias connected to the GND pin to maximize the number of the GND vias connected to the GND pin; connecting each GND pin to all the GND vias that match with said GND pin to form one signal return path; and minimizing a length of the signal return path by setting all the GND vias that match with said GND pin in close proximity to said GND pin in the signal return path.
Insulation distance check device
The insulation distance check device comprising: a unit which designates a high potential component, a conductive component and an insulation component to 3D CAD data; a unit which designates a distance condition; a unit which superimposes a layer surrounding the high potential component and creates a layer map associating the layer with a first distance; a unit which determines a second distance associated with the layer contacting with a portion of the conductive component, the second distance being a distance between the high potential component and the portion of the conductive component; a unit which compares the second distance and the distance condition; and a unit which displays at least one of a region occupied by the portion of the conductive component, on which the second distance having been determined to dissatisfy the distance condition is based; and a path connecting the high potential component and the conductive component.
Computer readable storage medium and method of forming electronic circuit diagram
There is provided a computer readable storage medium storing a program executable by a computer, and the program causes the computer to execute functions including: forming a first image in accordance with an electronic circuit diagram, in which a resistance value of a wiring portion is defined, to form the wiring portion by printing with a conductive ink; and correcting the first image in accordance with a second image, which is formed with a photothermal conversion material, when the first image is formed at least partially overlapping the second image, wherein the second image is an image for expanding a thermally expandable layer that thermally expands with heat and, when the image is irradiated with light, expanding the thermally expandable layer by converting the light into heat with the photothermal conversion material.