A method and system for reducing influence of a remote reference power noise on signal quality are provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.

A method of inspecting a printed circuit board (PCB) assembly includes acquiring an image of the PCB assembly and analyzing the image, wherein the analysis includes an object-based analysis of the image for recognizing at least one component placed on the PCB, wherein the object-based analysis is performed based on an object-based analysis program, and wherein the object-based analysis program includes a trained machine learning model. The method further includes: determining whether the at least one component is placed on the PCB based on a comparison between a finding of the object-based analysis and stored assembly information for the PCB; outputting an error when one or more components are missing or wrongly placed; inputting a result of a visual inspection of the PCB assembly that indicates a pseudo-error of the object-detection analysis; and writing one or more settings for soldering the PCB assembly by a soldering device.

A transmission path design assistance system assisting in the design of a transmission path with different reflection specification values for each frequency is obtained. The transmission path design assistance system includes: an acquisition unit to acquire reflection specification values of a reflection characteristic of a transmission path to be designed and a constraint of characteristic impedance distribution of the transmission path; and a computation processing unit including: a reflection characteristic calculation unit to calculate the reflection characteristic from inputted characteristic impedance distribution; a reflection characteristic modification unit to modify, on the basis of the reflection specification values acquired by the acquisition unit, the reflection characteristic calculated by the reflection characteristic calculation unit; a characteristic impedance distribution calculation unit to calculate characteristic impedance distribution from the reflection characteristic modified by the reflection characteristic modification unit; and a characteristic impedance distribution modification unit to modify, on the basis of the constraint acquired by the acquisition unit, the characteristic impedance distribution calculated by the characteristic impedance distribution calculation unit and output it to the reflection characteristic calculation unit.

A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.

A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.

A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.

Disclosed are a method, system and device for manufacturing a printed circuit board, and a computer storage medium. The method comprises: acquiring a printed circuit board to be manufactured which includes a via hole; acquiring shape information of the via hole; acquiring connection information of circuit layers in said printed circuit board; assembling preset conducting devices according to the connection information and the shape information, so as to obtain a target conducting device that matches the connection information and the shape information; guiding the target conducting device into the via hole to obtain a conducting printed circuit board; and connecting the conducting printed circuit board to obtain a target printed circuit board, wherein the types of the preset conducting devices comprise a metal conducting device, a non-metal conducting device and a semi-metal conducting device.

In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.

A method for designing a layout of a card edge connector and a server a card are provided. The method includes: determining, based on a type of a GND pin of a card edge connector and space between the card edge connector and GND vias, the number of GND vias connected to the GND pin to maximize the number of the GND vias connected to the GND pin; connecting each GND pin to all the GND vias that match with said GND pin to form one signal return path; and minimizing a length of the signal return path by setting all the GND vias that match with said GND pin in close proximity to said GND pin in the signal return path.

A circuit pattern is quickly created or changed by exposing the circuit pattern on a board without using a photo mask on which the circuit pattern is formed. There is provided a circuit pattern manufacturing apparatus including a forming unit that forms a circuit pattern by irradiating, with a light beam, a circuit pattern forming sheet including an insulating sheet base material layer and a mixture layer made of a mixture containing a conductive material and a photo-curing resin. The forming unit includes, as an optical engine, a housing, a laser diode, a prism mirror, an inclined mirror, a bottom mirror, and a driving mirror.